GLOBALFOUNDRIES and Soitec Announce RF-SOI Wafer Supply Agreement
Strategic supply agreement positions GLOBALFOUNDRIES to meet the growing demand for its most advanced RF-SOI solution, 8SW, used by top FEM providers...
Silicon Wafer Shipments Increase Quarter-Over-Quarter – All-Time Quarterly High
Reaching their highest recorded quarterly level ever on robust demand, worldwide silicon wafer area shipments rose 2.5 percent in the second quarter of 2018...
Die-to-Wafer Self-Assembly Breakthrough Targeting High Alignment Accuracy and Throughput
In a breakthrough for the future of die-to-wafer (D2W) bonding, CEA-Leti and Intel have optimized a hybrid direct-bonding, self-assembly process that has...
Integrated Passive devices (IPD) offer great opportunities in Smartphone Market
Driven by application diversification, IPDs continue their promising growth, announces Yole Développement (Yole). Miniaturization and integration are key drivers in electronic devices. This is even more...
GigaDevice’s GD5F1GM9 Series High-Speed QSPI NAND Flash Sets New Benchmark with Breakthrough Read Speeds for...
QSPI NAND Flash
GigaDevice, a leading semiconductor company specializing in Flash Memory, 32-bit Microcontrollers (MCUs), Sensors, Analog products and solutions, announces the...
Streamlining Project Efficiency with Murata’s Pre-Installed Electrical Models in Cadence Design Environment
Murata Manufacturing Co., Ltd. announces a significant collaboration with Cadence Design Systems, Inc., making product libraries directly accessible within Cadence’s leading Electronic...
Microchip Technology Expands Processing Portfolio with New PIC64GX MPUs Featuring Multi-Core 64-Bit Microprocessors
Real-time, compute intensive applications such as smart embedded vision and Machine Learning (ML) are pushing the boundaries of embedded processing requirements, demanding...
Nexperia now offers automotive planar Schottky diodes in space-saving CFP2-HP packaging
Nexperia announced that it is now offering a portfolio of 16 new low VF optimized planar Schottky diodes in CFP2-HP packaging. The portfolio includes...
Gate-All-Around Nanosheet Fabrication Process for HPC Devices
CEA-Leti has demonstrated fabrication of a new gate-all-around (GAA) nanosheet device as an alternative to FinFET technology targeting high-performance (HPC) applications such...
TI expands GaN power portfolio with industry’s smallest & fastest GaN drivers
Expanding on its industry-leading gallium nitride (GaN) power portfolio, Texas Instruments (TI) today announced two new high-speed GaN field-effect transistor (FET) drivers to create...
