Power Integrations Unveils SCALE-iFlex LT NTC IGBT/SiC Module Gate Drivers
SCALE-2 technology improves current sharing by 20 percent for the popular new dual style of 100 mm x 140 mm IGBT and...
Cambridge GaN devices launched second series of its ICeGaN 650 V Gallium Nitride HEMT...
Second series of ICeGaN 650 V Gallium Nitride HEMT family deliver best-in-class robustness, Ease-Of-Use & high efficiency
Cambridge GaN...
Infineon breaks ground for new Smart Power Fab in Dresden
Infineon Technologies has broken ground for a new Smart Power Fab in Dresden together with political leaders from Brussels, Berlin and Saxony....
Infineon partner with Chinese Silicon Carbide Supplier TanKeBlue
Infineon Technologies AG is diversifying its silicon carbide (SiC) supplier base and has signed a long-term agreement with Chinese Silicon Carbide Supplier...
Infineon diversifies its Silicon Carbide Supplier base; partner with SICC on wafers & boules
Infineon Technologies AG has signed an agreement with Chinese Silicon Carbide Supplier SICC to diversify Infineon's SiC material supplier base and to...
Magnachip released 600V Super Junction MOSFETs, Featuring Fast Recovery Body Diodes
Magnachip Semiconductor Corporation has released a new family of 600V Super Junction MOSFETs (Metal Oxide Semiconductor Field Effect Transistors) consisting of nine...
Cambridge GaN Devices will unveil next-gen ICeGaN HEMT family at PCIM 2023
Tuesday 9th to Thursday 11th May, Hall 7, Booth 372, Nuremberg Messe, Nuremberg, Germany
Cambridge GaN Devices (CGD) will...
Indian Semiconductor Industry set to cross $150 billion mark in next 5 years
ESSCI study provides roadmap for growth of Indian semiconductor industry & employment opportunities
Electronics Sector Skills Council of India...
Indium Corporation Joins India Electronics & Semiconductor Association
Advanced materials innovator Indium Corporation has joined the India Electronics and Semiconductor Association (IESA).
Through its involvement with the organization, Indium Corporation...
GaN & SiC Technologies, the key focus topics at PowerUP Asia Conference
The power electronics landscape is changing. Wide-bandgap (WBG) devices, including gallium nitride (GaN) and silicon carbide (SiC), are gaining traction in replacing...
