Sleek “Mouser Machine” Makes Second Appearance at Toronto Indy Race
Following a solid race in
Wisconsin, the Mouser-
and Molex-sponsored
IndyCar team is setting their sights on Honda Indy Toronto on July 14, where
the car...
Maxim Enhances MediaTek’s In-Vehicle Infotainment Platform
Maxim Integrated announced that select products from its automotive portfolio are being used in MediaTek’s AUTUS in-vehicle infotainment (IVI) platform. To...
DEV Systemtechnik confirms interoperability of DOCSIS 3.1 Remote-CCAP with DOCSIS Modems
DEV Systemtechnik supported by its partner SUMAVISION successfully tested the leading edge DOCSIS 3.1 Remote-MACPHY system DEV 6871 with a wide range of DOCSIS...
Automotive is driving SiC adoption
Automotive is driving the SiC power market.
SiC adoption is accelerating: is the supply chain ready?
Automotive-grade sic power device example: Tesla &...
Must-Attend IT Show: Reed Exhibitions Japan’s 27th Japan IT Week Spring
Japan IT Week Spring is the largest annual business platform in Japan for IT professionals, covering various sectors of IT ranging from microprocessors to...
DENSO to Integrate the Management of Two Subsidiaries that Manufacture Parts
DENSO Corporation today announced that on July 1, 2018 it will integrate the management of two DENSO Group companies: DENSO PREAS Corporation and DENSO...
Fujitsu and Microsoft Team Up for Artificial Intelligence
Fujitsu Limited and Microsoft Corporation today announced their agreement to collaborate in the field of artificial intelligence to accelerate the transformation of the ways...
World’s Smallest Sensor Device Supporting LPWA Communication by Fujitsu
Fujitsu Laboratories Ltd. today announced development of the world's smallest sensor that eliminates the need to replace batteries. The new sensor supports Low Power...
Alien and SensThys Launch Highly Networked IoT Solution that Addresses RFID Tag Visibility at...
Alien Technology, a leader in Radio Frequency Identification (RFID), and SensThys, an Internet of Things (IoT) and RF antenna specialist, announced a new highly...
Eliminating the Last Inch with Power on Package
We recently announced our new Power on Package technology that enables manufacturers of CPUs, GPUs and ASICs (XPUs) to place power components either on the substrate...
