Technavio recognizes the following companies as the key players in the global semiconductor foundry market: TSMC, GLOBALFOUNDRIES, UMC, SMIC, and SAMSUNG
Other Prominent Vendors in the market are: Dongbu HiTek, Fujitsu Semiconductor, Hua Hong Semiconductor, MagnaChip Semiconductor, Powerchip Technology, STMicroelectronics, TowerJazz, Vanguard International Semiconductor Corporation, WIN Semiconductors, and X-FAB Silicon Foundries.
Commenting on the report, an analyst from Technavio’s team said: “The latest trend gaining momentum in the market is Increasing adoption of 3D NAND. 3D NAND is a flash memory, wherein the cells are stacked vertically in multiple layers. 3D NAND will dominate solid state drives in 2017 since suppliers are planning to reduce the shipment of 2D NAND and planar NAND. 3D NAND flash drives can be used for IoT, smartphones, and smart cars. Many firms are producing fabs that focus solely on 3D NAND. In 2016, Western Digital started manufacturing 3D NAND chips with 64 layers.”
According to the report, one of the major drivers for this market is Increasing demand for IoT IoT is an ecosystem where many devices are connected to the Internet. These devices can include cellphones to tablets, cars, engines, and machines in plant production facilities. The business possibilities are numerous with the advent of IoT. Objects are assigned an IP address and can collect and receive data without the need for any manual operation of the device. From a broader perspective, devices can take decisions using the information/data that it has received without being dependent on manual help.
Further, the report states that one of the major factors hindering the growth of this market is Excess IC inventory. One of the biggest challenges that semiconductor foundries face is the increasing inventory level for ICs. Since the semiconductor market is extremely volatile, it is difficult to forecast what might be the demands for semiconductors in the future. At present, the semiconductor wafers that are being used to produce these chips are in the range 200-300 mm. But with an increasing need for small-sized electronics and wearable devices, there is a trend toward larger wafer size of 450 mm. The demand for chips that are formed by the 200-300-mm wafer can get impacted, and this could result in excess ICs inventory.
TSMC, GLOBALFOUNDRIES, UMC, SMIC, SAMSUNG, Dongbu HiTek, Fujitsu Semiconductor, Hua Hong Semiconductor, MagnaChip Semiconductor, Powerchip Technology, STMicroelectronics, TowerJazz, Vanguard International Semiconductor Corporation, WIN Semiconductors, and X-FAB Silicon Foundries.
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