ST Engineering’s electronics sector today announced the launch of DigiSAFE DiskCrypt M10, the world’s thinnest and first ultra-slim two-factor authentication (2FA) encrypted data storage that will help enterprises and governments secure their information assets with enhanced cybersecurity capabilities. Comparable to the size of a credit card and 80% lighter than existing encryption storage devices in the market, the DigiSAFE DiskCrypt M10 is equipped with sophisticated cyber defence features such as realtime hardware encryption and 2FA with smart card protection.
In a bid to counter increasing cyber-attacks and data breaches, enterprises and governments are facing an urgency to step up their cyber defences, including the implementation of secure information gateways with the use of high-performance cybersecurity solutions such as encryption and advanced persistent threat protection.
End users are often the weakest link in cybersecurity as increasingly sophisticated cyber threats are driven to exploit all areas of weaknesses. Building on our innovation and deep engineering expertise in cybersecurity, our robust cyber-secure products and solutions secure weaknesses at the end user point to help our customers strengthen their cyber preparedness and resilience,” said Mr Goh Eng Choon, General Manager of Info-Security, Electronics, ST Engineering.
With its ergonomic interface, the DiskCrypt M10’s storage capacity, ranging from 32GB to 512 GB, can be customised according to the needs of users. It is also designed to secure
information on-the-go, without requiring any software installation, enhancing ease of use without compromising security. The DigiSAFE DiskCrypt M10 will retail with six colours, delivering security and convenience that complements the diverse lifestyles of busy working professionals.
The DigiSAFE DiskCrypt M10, together with ST Engineering’s comprehensive suite of cybersecurity solutions will be on showcase at the GovernmentWare 2018, held at Suntec
Singapore International Convention & Exhibition Centre from 18 to 20 September 2018 (Hall 403, Booth G12), 9.00 am to 5.00 pm
