Mouser Electronics Presents Latest Technologies at Arm TechCon 2018

Mouser Electronics, Inc., the authorized global distributor with the newest semiconductors and electronic components, is proud to announce that it will host an exhibit featuring the newest technologies at Arm TechCon, October 16–18 at the San Jose (California) Convention Center.

One of the most anticipated events in the embedded industry, Arm TechCon is a unique interactive training ground designed to connect, instruct, advise and enable electronic and Arm-based computer design. The Expo and Conference provide attendees with a comprehensive understanding of Arm-based technology, with over 4,500 hardware designers and software developers expected to attend. Visitors can join Mouser at Booth 422 for information on the latest products for design engineers as well as a look at Mouser’s latest Empowering Innovation Together series.

“As a top distributor of Arm-based technologies and components, Mouser is glad to once again exhibit at Arm TechCon,” said Kevin Hess, Mouser Electronics’ Senior Vice President of Marketing. “This conference is an excellent opportunity for us to be at the forefront of embedded technology and to share information on the newest products from over 700 manufacturers available at”

In Booth 422, Mouser’s product experts will be answering questions and displaying some of the newest products available from its valuable suppliers Analog Devices, Cypress Semiconductor, Digi International, Infineon Technologies, Maxim Integrated, Microchip Technology, NXP Semiconductors, Renesas Electronics, Silicon Labs, STMicroelectronics, and Texas Instruments.

Representatives will also be available to discuss fascinating and relevant articles from Mouser’s Methods e-zine, a valuable source of design information that provides exclusive information on prototype development that every design engineer needs to drive new levels of innovation. Visitors to the Mouser booth can also enter for a chance to win a free Bose SoundLink Color Bluetooth speaker II.

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