Alpha and Omega Semiconductor Limited (AOS) introduced the TO-Leadless (TOLL) package in combination with a 60V and 100V Shield-Gate Technology (SGT) providing the highest current capability in its voltage class.
The TOLL package has the highest current capacity due to AOS’ innovative technology, which utilizes a clip to achieve the in-rush current. The TOLL packaging technology offers a very low package resistance and inductance due to the clip technology when compared to other TO-Leadless packages. This packaging technology uses a standard wire-bonding technology which enables improved EMI performance.
The AOTL66608 (60V), AOTL66610 (60V), and AOTL66912 (100V) have a 30% smaller footprint compared to a TO-263 (D2PAK) package and has a higher current capability which enables the designer to reduce the number of MOSFETs in parallel. The new device’s offer a higher power density compared to existing solutions.
They are ideally suited for industrial BLDC motor applications and battery management.
“Using the AOS TOLL package with clip technology offers performance improvement in a robust package. The AOTL66608, AOTL66610, and AOTL66912 can simplify new designs with the higher current capability to enable savings in overall system cost due to a reduced number of devices in parallel,” said Peter H. Wilson, Marketing Director of MOSFET product line at AOS.
The AOTL66608, AOTL66610, and AOTL66912 are immediately available in production quantities with a lead-time of 14-16 weeks.
The unit price for 1,000 pieces are $4.1, $2.3, and $4.56, respectively.
