Airspan Networks Inc. announced its collaboration with ON Semiconductor to capitalize on their industry-leading Wi-Fi 6 performance solutions, including the QCS-AX, for Fixed Wireless Access (FWA) applications.
Next-generation Airspan solutions will leverage ON Semiconductor’s QCS-AX Wi-Fi 6 family of chipsets. These products will maximize the benefits of the new standard including the additional spectrum in the 6 GHz band. The OFDMA-based 8×8 beamforming technology will significantly improve noise immunity, while enabling high-spectral efficiency and delivering multi-gigabit capacities, benefiting from the 160 MHz channels with modulation rates of 1024 QAM.
This collective effort enables Airspan to augment the reliability and scalability for Outdoor and FWA deployments using the ON Semiconductor’s Wi-Fi 6 solutions. Next generation Airspan products currently under development will address market demand for high spectral efficiency, interference immunity, and network orchestration capabilities for seamless carrier-grade deployments.
“We are excited to continue expanding on our existing collaboration with ON Semiconductor to deliver solutions to the market that offer an accelerated ROI with advantageous price/performance while guaranteeing network reliability with high capacity to complement our 5G deployment efforts“, said Eric Stonestrom, CEO, Airspan Networks.
“The FWA innovation has expanded Wi-Fi use case into outdoor space. By leveraging Wi-Fi 6 to offload LTE/5G networks, end consumers can expect fast and seamless connectivity. We are thrilled to continue working with Airspan to bring new connectivity to underserved markets,” said Irvind Ghai, VP Marketing, Quantenna Connectivity Solutions at ON Semiconductor.
FWA demands continue to advance where capacity and reliability are critical for day-to-day use in schools, hospitals, law enforcement, economic growth, etc. Airspan Networks is positioned to continue to address market needs and shape the networks of tomorrow.
