Mouser Electronics, Inc., the New Product Introduction (NPI) leader empowering innovation, announces the newest issue of the Methods technology and solutions journal, available with a free subscription. Confronting AI offers a collection of articles that explore artificial intelligence (AI) and machine learning (ML) as well as the adoption challenges, ethical dilemmas, and regulations that accompany this new technology. The journal also highlights the products that are driving AI’s evolution, featured below.
The 5th Gen Xeon processors by Intel (also known as Emerald Rapids) deliver high performance without an increase in power consumption. While 4th Gen Intel Xeon had up to four chiplets, the 5th Gen has two larger dies with an increased density that allows for more cores. These larger clusters, with their increased L3 cache capacity, four channels of memory, and 32 functional cores, are well suited to large virtual machines used to develop AI applications.
The STM32N6 microcontroller from STMicroelectronics features a proprietary Neural-ART Accelerator, specifically architected for embedded inference and delivering 600 times more ML performance than previous high-end STM32 MCUs. The STM32N6’s ML performance is ideal for computer vision, audio processing, and sound analysis for consumer and industrial applications at the edge. The STM32N6 delivers remarkable AI performance and provides excellent flexibility in a small silicon package ideal for smart industry, smart agriculture, robotics, and wearables.
The AIK-RA6M3 AI/ML reference kit from Renesas Electronics is a complete demonstration and prototyping platform designed to help accelerate AI- and ML-based designs. The kit features a pre-mounted Renesas RA6M3 32-bit microcontroller, multiple interfaces, and an onboard debugger. The kit also supports USB Full Speed, CAN, Ethernet, a TFT display, a camera, and a microphone. An onboard TDK InvenSense ICM-42670-P six-axis inertial measurement unit (IMU) also enables the kit to support asset movement recognition applications. Renesas’ free-to-use Reality AI Software Suite enables the simple development of AI and ML solutions for industrial, automation, commercial, and automotive applications.
Even the fastest of processors are only as good as their connections. While a fast CPU is vital, its ability to efficiently process data is heavily influenced by how quickly it can access and interact with memory, storage, power, and other parts of the system. The Z-PACK HM-eZD backplane connectors from TE Connectivity offer data rates of up to 56 Gbps with a high-density design ideal for data center applications. The Mirror Mezz Pro connectors by Molex offer stackable mating that supports data speeds up to 112 Gbps per differential pair. The PwrBlade ULTRA HD+ board-to-board connectors from Amphenol FCI are specifically designed to deliver the high power (up to 100A per contact) required in AI and ML applications, with a low profile that enables airflow for efficient system cooling.
In addition to the Methods technology and solutions journal, Mouser offers a broad range of resources for design engineers and buyers, including blogs and eBooks. Mouser’s Empowering Innovation Together program features podcasts, articles, and videos discussing the hottest engineering topics impacting engineering design, and the technical resource hub includes exclusive design resources, white papers, and product information, allowing design engineers to break new ground in product development and innovation.
To read all issues of Methods, including the newest issue on AI, sign up for a free subscription at https://eng.info.mouser.com/methods-ezine/.
