UF 88UVOptical Underfill – YINCAE Advanced Materials, LLC announces the launch of UF 88UV, an innovative high-transparency optical underfill designed for optical modules, optoelectronic devices, and advanced semiconductor packaging.
UF 88UV delivers approximately 100% visible-light transmittance, providing exceptional optical clarity for applications where maintaining a highly transparent optical path is critical. In competitive evaluations, customers selected UF 88UV over competing underfill solutions for demanding optical module applications.
Beyond its outstanding optical performance, UF 88UV offers excellent processability. The material flows readily at room temperature into small gaps, supporting efficient underfill processing without the need for elevated-temperature dispensing. After cure, UF 88UV exhibits fluorescence, enabling easy inspection and verification of underfill coverage.
UF 88UV also demonstrates outstanding reliability. After Pressure Cooker Testing (PCT) followed by five 260°C reflow cycles, the material exhibited no observable change in optical properties and no delamination.
Key Benefits of UF 88UV
- Approximately 100% visible-light transmittance
- Selected by customers over competing underfill solutions
- Room-temperature flow into small gaps for easy processing
- Fluorescent after cure for easy inspection
- No observable change in optical properties after PCT and 5× 260°C reflow
- No delamination after reliability testing
- Designed for optical modules, optical sensors, imaging devices, optoelectronic
- components, and advanced semiconductor packaging
For more information visit: www.yincae.com
