congatec – a leading vendor of embedded and edge computing technology – announced a technology collaboration with Qualcomm Technologies, Inc. that will speed the commercialization of high-performance embedded edge AI applications for size, power, and weight (SWaP) constrained industrial products based on Qualcomm Dragonwing processors. In a first step, the technology collaboration unlocks the versatility of congatec’s application-ready COM-HPC Mini Computer-on-Modules portfolio for developers using Qualcomm Dragonwing IQ-X Series processors.
“Our new technology collaboration with Qualcomm Technologies allows developers to achieve the same level of extreme computing performance and interface bandwidth with a power-efficient design that was only possible with x86 architectures for decades,” said Konrad Garhammer, CTO & COO, congatec. “For the first time, developers can create high-end embedded applications that leverage the outstanding energy efficiency and performance per watt for the most performance-intensive embedded hardware on a form factor that’s nearly the size of a credit card.”
“Our collaboration with congatec combines best-in-class compute performance, industry-leading power efficiency, on-device AI and industrial-grade features of the Dragonwing IQ-X Series with the flexibility, scalability and ruggedness of congatec’s COM-HPC Mini portfolio and application-ready ecosystem,” said Enrico Salvatori, Senior Vice President and President of Qualcomm Europe, Inc. “Together, we are driving the transformation of intelligent industries by delivering superior platforms that empower customers to create next-generation industrial PCs, and deploy edge AI applications at scale.”
For more information, visit: COM-HPC Mini
