Solder Alloy Reliability – Indium Corporation® Senior Global Product Manager, Semiconductor and Advanced Materials, Sze Pei Lim will present a collaborative International Electronics Manufacturing Initiative (INEMI) project comparing SnBi and SAC305 solder alloys for first-level interconnects in complex heterogeneous packages. The session will be conducted at the International Conference on Electronics Packaging and Hybrid Bonding Symposium (ICEP-HBS), April 14-17, in Hiroshima, Japan.
The presentation, Thermal Stress Study of Low Temperature Material for 1st Level Interconnect, will demonstrate how SnBi solder interconnects provide superior dimensional stability—reducing warpage by 70+ microns through lower processing temperatures—while matching SAC305’s proven thermal aging and shock resistance. These results enable optimized material selection for next-generation high-performance, high-density semiconductor packages requiring exceptional thermomechanical reliability. Indium Corporation Metallurgist Danyang Zheng and five other INEMI collaborators contributed to the study.
As Senior Global Product Manager for Semiconductor and Advanced Materials, Sze Pei Lim works closely with Indium Corporation’s internal sales and R&D teams to develop solutions for industry needs and requirements. She also collaborates with external customers and corporate partners to support the industry’s move toward heterogeneous integration. Some of her recent work includes the development of materials and processes for advanced packaging for fine feature printing for SiP applications, as well as for one-step OSP ball-attach applications.
ICEP-HBS visitors can attend Lim’s presentation on Wednesday, April 15, at 9:00 a.m. JST.
