Advanced Power Materials – Heraeus Electronics will showcase its latest advancements in power electronics materials at PCIM Europe 2026, June 9-11 in Nuremberg, Germany. Exhibiting in Hall 6 #310 at its established booth location, the company will highlight innovations that connect materials, applications, and people—helping customers tackle increasingly complex power electronics challenges.
Advancing Die and Module Attach Performance
Heraeus Electronics will focus on solutions that deliver high thermal performance, reliability, and process flexibility:
- mAgic® PE340 Silver Pressure Sinter Paste (NEW)
Designed for dense packaging, this paste offers precise printing and defined edge formation for optimized material use. Multi-process compatibility—including printing, dispensing, and dry or wet placement—ensures seamless integration into production. - Microbond® Solder Preforms (NEW)
Improves module attach reliability over traditional alloys and uses Innolot® technology for lower melting temperatures. The latest Innolot® 2.0 reduces silver content while maintaining performance, supporting IGBT applications up to 150°C junction temperature. - mAgic® PE360 Sinter Paste (Global Technology Award Winner 2025)
With thermal conductivity ≥200 W/mK, this material enables maximum system efficiency and supports SiC module attach applications above 150°C. It is qualified in automotive projects, and its flexible application makes it suitable for various manufacturing processes. These solutions as well as the rest of the portfolio of matched power electronics materials such as metal ceramic substrates, solder pastes, die top system and bonding wires, demonstrate Heraeus Electronics’ approach to connecting advanced materials with real-world manufacturing needs, balancing performance, cost, and scalability.
Sharing Expertise and Building Connections
Heraeus Electronics will host live presentations at its booth, providing insights into new materials, applications, and collaborations. Visitors can engage directly with experts to explore practical approaches to current industry challenges. Detailed information can be found on the website closer to the event.
In addition, Heraeus Electronics will present on the e-Mobility Stage (hall 6, 220):
- “SilverFree Substrates and Interconnects: NextGen Materials for Scalable Automotive Power Modules”
Dr. Raghavendra Nunna
Examining the move toward silver-reduced and silver-free materials to meet performance demands while addressing supply chain volatility in automotive power modules. - June 9 at 12:30-12:50 (GMT+1) “Advancing Embedded Power: Copper Sinter Innovations for NextGen e-Mobility”
Florian Seifert
Highlighting copper sinter innovations that enable compact, high-performance embedded designs with improved thermal and mechanical reliability. - June 10 at 12:30-12:50 (GMT+1)
Enabling Technological Progress
Together with its customers and partners, Heraeus Electronics creates lasting connections—between materials and the people behind them. The company develops and manufactures innovative material solutions that enable technological progress in everyday life. By bridging materials science with application expertise, the company helps power electronics advance across industries where performance and reliability are critical.
Visitors are invited to connect with Heraeus Electronics at PCIM Europe 2026 to explore how collaboration and material innovation are shaping the future of power electronics.
For more information visit www.heraeus-electronics.com.
