SIPLACE V Placement Platform – ASMPT SMT Solutions, the global market and technology leader in integrated hardware and software solutions for electronics manufacturing, received a strong response from visitors at Productronica India 2026 in Bengaluru. The ASMPT booth saw a steady stream of visitors throughout the three-day event. Particular attention focused on the India debut of the new SIPLACE V placement platform and the live demonstration of large BGA placement for AI server applications on the SIPLACE SX.
“The response over all three days was overwhelming. Our booth was continuously busy, and we had many valuable discussions with electronics manufacturers from different industries,” says Neeraj Bhardwaj, General Manager for India, Bangladesh & Sri Lanka at ASMPT SMT Solutions India. “The solutions we presented covered a broad range of requirements in the Indian electronics market – from telecommunications and automotive to EMS. The machines on display gave visitors the opportunity to experience the technologies first-hand and discuss their specific production requirements with our experts.”
Strong interest in the new SIPLACE V
Visitors were particularly interested in the performance improvements offered by the new SIPLACE V platform and how it compares with existing placement solutions. Designed from the ground up, the SIPLACE V combines significantly higher real performance with flexibility and high process quality. Its new machine architecture, featuring a highly rigid frame, efficient linear drives and high-resolution measurement systems, enables higher acceleration and shorter non-productive movements. Under real production conditions, the platform achieves performance gains of up to 30 percent in key electronics manufacturing sectors. Its high-speed placement head processes up to 52,500 components per hour with a placement accuracy of 25 µm @ 3σ. The platform also covers a broad spectrum of components, from ultra-small 016008M components to large-format and challenging ones.
Large BGA placement attracts attention
Another focus at the booth was the production of AI server boards and, in particular, the handling and placement of increasingly large and heavy processor BGAs, demonstrated live on the SIPLACE SX placement platform. Such modules can measure up to 150 × 150 millimeters and weigh more than 500 grams.
For these demanding applications, the SIPLACE SX can be equipped with the placement head TWIN VHF for large and heavy processor BGAs. Component-specific nozzles and consideration of the individual BGA’s mass inertia during program generation help ensure reliable handling and placement even of heavy components. Its Heavy-Duty Conveyor handles boards weighing up to ten kilograms, while SIPLACE Smart Pin Support automatically positions and continuously monitors support pins to prevent warpage of large boards. The DEK TQ printer complemented the presentation with high-precision solder paste printing.
Solutions for a diverse electronics market
The hardware demonstrations were complemented by the WORKS software suite for all workflows along the SMT line, as well as by ASMPT Factory Solutions for the holistic optimization of the SMT production. Visitors were able to see for themselves how production data can be used to increase transparency and identify opportunities for optimization throughout the intelligent factory.
