Protecting Prototypes with Automotive Overvoltage Protection
Protecting Prototypes with Automotive Overvoltage Protection:
Abstract
This article describes the use of a load...
SST and UMC Announce Immediate Availability of 28nm SuperFlash Gen 4 Automotive Grade 1 Platform
28nm SuperFlash Gen 4 Automotive Grade 1 Platform:
As the automotive industry requirements for increasingly performant vehicle controllers relentlessly...
What’s New in MIPI Security: MIPI CCISE and Security for Debug
As the need for security becomes increasingly more critical, MIPI Alliance has continued to broaden its portfolio of standardized solutions, adding two...
Toyota Systems, Fujitsu utilize quantum-inspired technology and AI to streamline on-board computer design and...
Toyota Systems Corporation (Toyota Systems) and Fujitsu Limited, in collaboration with Toyota Motor Corporation (Toyota), announced the successful application of quantum-inspired technology...
Tesla recalled more than 115,000 Cybertrucks in 2025, NHTSA data shows
Finbold released new research revealing that Tesla recalled more than 115,000 Cybertrucks in 2025, based on official manufacturer filings submitted to the U.S. National Highway Traffic...
Connectivity Solutions for Non-Terrestrial Networks (NTN)
Non-Terrestrial Networks Automotive Connectivity Solutions:
Networks that achieve comprehensive coverage, such as electrical grids, telephones and the Internet,...
EV Chargers Market: Transforming Power Access in the Age of Electric Mobility
The global transportation sector is undergoing one of the most profound transformations in modern history. Electric vehicles are no longer niche innovations—they...
Infineon and HL Klemove collaborate to advance automotive innovation for software-defined vehicles
Infineon Technologies AG and HL Klemove have signed a Memorandum of Understanding (MoU) to strengthen their strategic collaboration in automotive technologies. The...
Hyundai Mobis and Qualcomm Sign Comprehensive Agreement to Collaborate on SDV Architecture for ADAS
Hyundai Mobis Qualcomm SDV agreement:
MOU signed at CES 2026 to co-develop integrated solutions for automotive tailored to emerging markets.
Synopsys Showcases Vision For AI-Driven, Software-Defined Automotive Engineering at CES 2026
Key Highlights:
Synopsys will support the Fédération Internationale de l'Automobile (FIA), the global governing body for motorsport...
