COAI & 5G-ACIA sign MoU to promote Industrial 5G
COAI, the apex industry association representing the country's major Telecom, Internet, Technology & Digital Services companies, has signed a Memorandum of Understanding...
Siemens acquires UltraSoC
Siemens has signed an agreement to acquire Cambridge, UK-based UltraSoC Technologies Ltd., a provider of instrumentation and analytics solutions that put intelligent...
Mouser Electronics Earns Two Top Distribution Awards from Vishay
Mouser Electronics has been named the 2019 Americas Catalog Distributor of the Year by Vishay Intertechnology, a leading global manufacturer of a...
For 5G New Radio small cell SoC Picocom selects UltraSoC in-system analytics & monitoring...
UltraSoC announced that Picocom, the 5G open RAN baseband semiconductor and software specialist, has selected UltraSoC's hardware-based analytics and monitoring IP for use in...
Mouser Electronics Named Molex Global e-Catalog Distributor of the Year
Mouser Electronics, Inc., the authorized global distributor with the newest semiconductors and electronic components, has been named the 2019 Global e-Catalog Distributor...
Data transmission rate World Record for LiFi Broken
CEA-Leti on June 11, announced that its researchers have broken the throughput world record of 5.1 Gbps in visible light communications (VLC)...
World’s First CMOS-based SWIR Camera Evaluation starts
TriEye has officially revealed Sparrow - the world's first CMOS-based SWIR camera.
Among the companies that are collaborating with...
I3C Multiplexers and IO Expanders Deliver 12.5MHz Speeds in Small Footprint
Renesas Electronics unveiled four new I3C Basic bus extension products for control plane designs across a variety of applications, including data center...
SweGaN named a finalist in the Nordic region’s Techarena Challenge 2020
SweGaN is selected as one of the Nordic region's 50 leading companies in the Techarenan Challenge 2020 (web-article in Swedish).
For...
KONNEKT packaging technology in KEMET’s KC-LINK range
KEMET Corporation extending its KC-LINK range using KONNEKT high-density packaging technology to meet the growing demand for fast-switching wide bandgap (WBG) semiconductors,...
