Anritsu and MVG collaborate to support IEEE 802.11be (Wi-Fi 7) OTA measurement solution
Wi-Fi 7 OTA test solution
Anritsu Corporation announces a new solution that combines Microwave Vision Group's (MVG) multi-probe OTA (Over The Air) test systems with Anritsu's Wireless Connectivity Test Set MT8862A to support IEEE 802.11be (Wi-Fi 7) OTA measurements.
Wi-Fi 7 is a standard designed to achieve high throughput for...
Anritsu interviewed the Aalborg University Professor on 6G Research Trends
Anritsu Interviews Prof. Wei Fan on 6G Research Trends
Anritsu Corporation interviewed Professor Wei Fan (currently Professor at Southeast University in China), head of the “Radio Channel and OTA Testing” research group at Aalborg University in Denmark. The discussion highlighted groundbreaking 6G technology in wireless communication, cutting-edge measurement technology, and the significant achievements...
Future of Pro Audio, AV, and Lighting Unfolds at PALM AV-ICN Expo 2025 Amidst India’s Booming $17.3B Market
PALM AV-ICN Expo 2025
India's largest platform for professional audio, AV integration, and entertainment lighting technologies returns for its 23rd edition.
300+ exhibitors and 1000+ brands including HARMAN, YAMAHA, Shure, L-Acoustics, Epson, Robe, and Clay Paky showcase cutting-edge innovation.
25,000+ professionals, integrators, and decision-makers convene...
Murata Manufacturing has commercialized common mode choke coils for vehicles that support high temperature environments of 150°C and large currents of 15A
Murata Manufacturing Co., Ltd. has newly added a lineup of products that can be used in high temperature environments of 150°C to the common mode choke coil "PLT10HH series," which are suited to reducing noise on power supply lines for in-vehicle equipment. Mass production began in Jun 2025.
Nowadays, with the increasing sophistication of...
Now at Mouser: TDK InvenSense’s ICU-30201 Ultrasonic Time-of-Flight Range Sensor for Ultra-Long-Range Applications
ICU-30201 Ultrasonic ToF Sensor
Mouser Electronics, Inc., the industry's leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components, is now stocking the ICU-30201 ultrasonic time-of-flight (ToF) range sensor from TDK InvenSense. The ICU-30201 is a high-performance ToF sensor for ultra-long-range applications, measuring distances from 30 cm to...
FlashPCB Expands High-Speed Production Capabilities with New Hanwha SMT Equipment
FlashPCB, a leading provider of quick-turn PCB assembly, has announced the recent purchase of two advanced SMT systems from Hanwha Semitech Americas: the SM481 Advanced High-Speed Flexible Mounter and the SM482 Advanced Flexible Mounter. This investment marks a significant step forward in FlashPCB’s mission to deliver even faster, more flexible, and more reliable electronics manufacturing services.
IFS and NEC Strengthen their Strategic Partnership to Create New Value
IFS AB and NEC Corporation are strengthening their strategic partnership to create new value. Through this partnership, the two companies will further combine their strengths to accelerate the implementation of solutions in global markets, mutually enhance their resources and skills, and support the continued growth of their customers.
As the leading provider of Industrial...
STMicroelectronics combines activity tracking and high-impact sensing in miniature AI-enabled sensor for personal electronics and IoT
ST LSM6DSV320X: AI-Enabled Dual-Accelerometer IMU for High-Impact and Activity Tracking
STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, has revealed an inertial measurement unit that combines sensors tuned for activity tracking and high-g impact measurement in a single, space-saving package. Devices equipped with this module can allow applications...
VIAVI and 3-GIS Partnership Enables Faster, More Accurate Fiber Fault Location at Windstream Wholesale
Viavi Solutions Inc. (VIAVI) and 3-GIS, a market-leading fiber network design and management software provider, announced a partnership to empower businesses with faster, more accurate fiber fault location capabilities, while also leveraging customers’ existing Geographic Information System (GIS) investments. The combined solution, currently deployed at Windstream Wholesale, automates the current manual processes, offering significant advantages in improving network maintenance,...
MYIR Unveils i.MX91-Based SOM to Power Next-Gen Smart Devices
MYC-LMX91 SoM
MYIR announces the launch of its latest embedded computing solution, the MYC-LMX91 System-on-Module (SoM), powered by NXP's energy-efficient i.MX 91 processor. This compact, high-performance module maintains full pin compatibility with MYIR's existing MYC-LMX9X (i.MX93) series, allows customers to scale their designs without hardware redesigns.
The MYC-LMX91 features a compact design, measuring just 37mm...