Report: Generative AI adoption in retail organisations soars to 95%, shadow AI and data risks persist
The report shows that generative AI (genAI) adoption in the retail sector has surged to 95%, up from 73% last year. While adoption is up, the use of personal genAI accounts at work in retail has dropped sharply, from around 74% of the workforce using personal genAI accounts at work in January to 36% in June. The use...
Compact Click dev tool from MIKROE delivers precise control of brushed DC motors in industrial and robotic applications
DC Motor 31 Click is a compact add-on board designed to drive brushed DC motors providing precise control, torque adjustment, and fault monitoring for a wide range of applications. Produced by MIKROE, the embedded solutions company that dramatically cuts development time by providing innovative hardware and software products based on proven standards, DC Motor 31 Click is a recent...
India Can Lead in Semiconductor Innovation, If We Skill Right
When you hold your smartphone, drive your car, or even switch on your smart TV, there's an invisible heartbeat inside, semiconductors. These tiny chips power satellites in orbit, fighter jets in the skies, and the AI algorithms reshaping our lives. For years, India has depended on importing these critical components, an Achilles' heel for a country that...
YINCAE Launches Diamond Underfill UF 158D with 8 W/m·K Thermal Conductivity
YINCAE, a leader in advanced electronic materials, has introduced Diamond Underfill UF 158D, delivering 8 W/m·K thermal conductivity—a new standard in heat dissipation for advanced semiconductor packaging.
Built with nano-engineered diamond particles, UF 158D combines high thermal performance with excellent mechanical reliability, low CTE mismatch, and strong adhesion. It is optimized for flip-chip, 2.5D/3D...
MSI Adopts Anritsu’s High-Speed Interface Evaluation Solution
Micro-Star International Co., Ltd. (MSI), a global leading vendor for computer hardware, has selected Anritsu’s signal integrity evaluation solution, Signal Quality Analyzer-R MP1900A and Vector Network Analyzer MS46524B, for high-speed digital interfaces, including the PCI Express (PCIe) standard.
The rapid proliferation of AI and IoT technologies has driven a significant increase in data transmission volumes. As a...
Ingram Micro Appoints Flavio Moraes Junior as Managing Director and Chief Country Executive for India
Ingram Micro, a business-to-business (B2B) platform company for the global technology ecosystem, announced the appointment of Flavio Moraes Junior as Managing Director and Chief Country Executive (CCE) for India, effective October 1, 2025. Moraes succeeds Navneet Singh Bindra, who retires after more than 22 years of leadership and service to Ingram Micro India.
Moraes transitions to lead Ingram Micro's...
Indium Corporation Expert to Present on Innovative Thermal Management Solution at IMAPS Thermal Conference
Indium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on a new liquid metal containment method for thermal interface material (TIM) applications at the IMAPS Thermal Conference, to be held October 2 in San Diego, California. The conference will be co-located with the IMAPS International Symposium on Microelectronics.
The presentation, Haggis: A New...
JERA and DENSO Begin Japan’s First Demonstration of SOEC Hydrogen Production at a JERA Thermal Power Station
JERA Co., Inc. ("JERA") and DENSO CORPORATION ("DENSO") hereby announce that they have begun demonstration testing of hydrogen production at JERA's Shin-Nagoya Thermal Power Station (Nagoya, Aichi) using SOEC water electrolysis systems developed by DENSO (electrolysis power: 200kW).
Because it emits no CO2 when burned, hydrogen is being considered for use in a variety...
Synopsys Collaborates with TSMC to Enable 2D and 3D Design Solutions
Key Highlights:
An AI-assisted optimization workflow helps shorten design cycle times on TSMC's compact universal photonic engine (COUPE) platform and strengthens design quality using Ansys optiSLang, Ansys Zemax OpticStudio, and Ansys Lumerical FDTD simulation software
Ansys HFSS-IC Pro platform is certified for system-on-chip electromagnetic extraction with TSMC's N5 and N3P process technologies
Ansys...
Vishay Intertechnology Releases New 1 A and 2 A Gen 7 1200 V FRED Pt® Hyperfast Rectifiers in SlimSMA HV (DO-221AC) Package
Vishay Intertechnology, Inc. expanded its Gen 7 platform of 1200 V FRED Pt® Hyperfast rectifiers with four new devices in the eSMP® series SlimSMA HV (DO-221AC) package. Optimized for industrial and automotive applications, the 1 A and 2 A rectifiers not only offer the best trade-off between reverse recovery charge (Qrr) and forward voltage drop for devices...