Global Field-Programmable Gate Array (FPGA) Market to Reach USD 12,989.1 million by 2023
Global field-programmable gate array (FPGA) market is expected to increase from USD 7,116.6 million in 2016, to USD 12,989.1 million in 2023, at a CAGR of 9.0% from 2017 to 2023. The factors driving the global field-programmable gate array (FPGA) market are increasing demand for smart-phones and hand held devices, increasing demand for bandwidth in wireless networks, and growing...
Metal plate power shunts for high current applications from KOA now in stock at TTI, Inc.
Now available in Europe through TTI, Inc., a world leading specialist distributor of electronic components, are PSJ2/PSL2 (2 terminals) and PSG4/PSF4 (4 terminals) series power shunts from KOA which have been newly added to the PS series. Constructed using a solid metal alloy resistance element with copper terminals the devices provide superior corrosion and heat resistance, along with excellent...
HR Excellence Award: Continental Receives Award for Europe Initiative
HR Excellence Award for the initiative “We l.o.v.e. Europe” in the field of corporate social responsibility (CSR)
Dr. Reinhart, Executive Board member for Human Relations: “It’s important for all of us to fulfill our corporate responsibility for a peaceful and united Europe”
Additional award in the Employee Commitment & Collaboration category
For the second time in a row, Continental...
TGI Solar Power is Pleased To Announce That it has Signed a MOU with Electric Cars Ltd of Kiev
TGI Solar Power Is Pleased To Announce That It Has Signed a MOU with Electric Cars Ltd of Kiev
TGI will act as project manager and will own a percentage of the total enterprise. TGI and its management team has been working on this project for over two years and is very pleased with the overall progress made to date with...
Renesas Electronics Accelerates Industrial Ethernet Application Development with New RZ/N1 Solution Kit
Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, announced the availability of the new RZ/N1 microprocessor (MPU) Solution Kit designed to support various industrial network applications including programmable logic controllers (PLCs), intelligent network switches, gateways, operator terminals and remote I/O solutions.
The new RZ/N1 Solution Kit is a complete development package that includes the hardware and software to...
Merge the worlds of wired and wireless connectivity by connecting sensors to the cloud with new TI SimpleLink Ethernet MCUs
Making it easier for developers to connect sensors from a gateway to the cloud, Texas Instruments (TI), introduced Ethernet connectivity to the SimpleLink microcontroller (MCU) platform, a single hardware, software and tool platform for wired and wireless MCUs. The new SimpleLink MSP432 Ethernet MCUs are based on a high-performance 120-MHz Arm Cortex-M4F core with an integrated MAC and PHY, helping...
NI Announces New IP67 Edge Nodes for the Industrial Internet of Things
NI, the provider of platform-based systems that enable engineers and scientists to solve the world’s greatest engineering challenges, announced that the IC-3173 Industrial Controller, NI’s first IP67-rated controller. The new controller is ideally suited to act as an Industrial Internet of Things edge node in extremely harsh locations including spray down manufacturing environments, test cells and outdoor locations without...
Medical Robotics Technology & Market Analysis report from YoleDéveloppement
Robotics has a long, colorful history, but its applications have only recently impacted the healthcare industry. YoleDéveloppement (Yole), the “More than Moore” market research and strategy consulting company is investigating this domain to identify the evolution of the healthcare industry and its needs and understand the related technology challenges.
In 2000, the field’s current main player, Intuitive Surgical, was one...
Keeping ESD Threats Short Lived in Automotive Applications
Most silicon ESD protection solutions in the market today are mainly designed for consumer devices in mind, but ESD threats also keep automotive electronic designers up at night. Not only are automotive designers worried about the “normal” ESD situations, but additional automotive specific events are a cause for serious concern one of which is a short-to-battery (STB) condition.
The STB event...
DENSO and NEC Establish a Joint Venture to Develop Essential Connectivity Technologies for Cars of the Present and Future
DENSO Corporation and NEC Platforms, Ltd., a subsidiary of NEC Corporation, unveiled a new joint venture, DENSO NEXT CO., LTD. The company will develop in-vehicle information and communications equipment critical for fostering a truly connected environment inside vehicles, such as instrument clusters, head-up displays, and on-board communication equipment. The company will start operations on December 1, 2017.
The recent cockpit...