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High-performing Sony SPRESENSE platform available from RS Components

Sony SPRESENSE
Wearable-ready SoC combines with digital and analog audio, dedicated camera interface, plus GNSS and sensor fusion RS Components is boosting opportunities to create smarter IoT devices by introducing Sony SPRESENSE, featuring Arm Cortex-M4F performance and extensive sensing, audio, and imaging capabilities. The low-power SPRESENSE platform, comprising a 50.0mm x 20.6mm main board and 68.6mm x 53.3mm extension board, combines the Sony CXD5602 system-on-chip...

New RF Probe Models Support Higher Data Rates in Both GS & GSG Configurations

Coaxial RF Probes
Fairview Microwave has expanded their line of RF coaxial probes into the 40 GHz frequency range for use in high-speed communications, microwave components and networking applications. Fairview Microwave’s expanded line of coaxial RF probes now includes four models that deliver 10 dB maximum return loss over a broad frequency range of DC-40 GHz. These new RF probes are offered in GS and...

12-bit LED driver family offers a 29-kHz dimming frequency for HMI applications

DC/DC buck converter
Texas Instruments (TI)  introduced a new family of LED drivers with integrated, independent color mixing, brightness control and a power-saving mode. The LP5018, LP5024, LP5030 and LP5036 enable smooth, vivid color and reduce system power consumption. The devices are the industry’s first to offer a 29-kHz dimming frequency, above human-audible range, to help designers of applications that use a human-machine...

Standalone Baseband Processing & RF Module for Specialized LTE Applications

Baseband Processing & RF Module
CommAgility announced the CA-K2L-RF2, a standalone high performance processing module that includes ARM- and DSP-based cores with two integrated wideband RF transceiver channels. Based on CommAgility's existing AMC-K2L-RF2 board, the new CA-K2L-RF2 module provides a competitively-priced option to provide LTE and LTE-Advanced capabilities in private, customized and specialized networks. It measures 175mm (L) x 122mm (W) x 28mm (H), making it...

Industry’s First 300mm SiGe Foundry Technology to Meet Growing Data Center & High-Speed Wireless Demands

Silicon Germanium Foundry
GLOBALFOUNDRIES announced its advanced silicon germanium (SiGe) offering, 9HP, is now available for prototyping on the company's 300mm wafer manufacturing platform. The move signifies the strong growth in data center and high-speed wired/wireless applications that can leverage the scale advantages of a 300mm manufacturing footprint. By tapping into GF's 300mm manufacturing expertise, clients can take advantage of increased production efficiency and...

5-yr Connected Vehicle Cloud Worldwide Deal Signed by Ericsson & Volvo Cars

Ericsson & Volvo Cars
Ericsson Connected Vehicle Cloud (CVC) platform with global operational support to benefit Volvo Car Group worldwide market Ericsson and Volvo Cars signed first Connected Vehicle Cloud deal in 2012 Industrialized Ericsson Connected Vehicle Cloud platform can benefit all automotive players Ericsson has been selected by Volvo Car Group (Volvo Cars) to provide the industrialized Ericsson Connected Vehicle Cloud (CVC)...

MicroBT employs Moortec’s 16nm Embedded Temperature Sensor in their HPC ASIC

MicroBT
Moortec, providers of complete In-Chip Monitoring PVT Subsystems today announced that Shenzhen MicroBT Electronics Technology Co., Ltd. have employed Moortec's 16FFC Temperature Sensor IP in their latest high performance computing (HPC) ASIC. HPC is highly intensive in terms of CPU activity and requires ever increasing levels of computing power. This increased power consumption requires more electricity and this leads to...

Infineon and IDEX Biometrics: Working together to advance biometric card landscape

Infineon and IDEX
Working together to advance the biometric card landscape: Infineon Technologies AG and IDEX Biometrics, the leading provider of advanced fingerprint identification and authentication solutions have joined forces. The two companies aim to seamlessly integrate IDEX’ biometrics technology into platforms featuring Infineon’s secure elements and will develop a system-on-card demonstrator that runs on the latest dual-interface 16-bit security controller from...

AAEON honored Machine of the Year Award at EVEX 2018

AAEON
AAEON, a leading developer of industrial, IoT, and AI computing solutions, has been honored with the Machine of the Year award at EVEX 2018, a European Vending & Coffee Service Association event in Sevilla, Spain. The award recognizes AAEON's capability in the technology of future vending services and the commitment in the A.I. ecosystem. The awarded intelligent vending machine manufactured...

Vishay Intertechnology F339X2 305VAC X2 EMI Suppression Film Capacitors

F339X2 305VAC X2 EMI Suppression
For Longer Service Life in Harsh Conditions, Automotive Grade Devices Withstand THB Testing of 85 °C, 85 % RH for 500 Hours at Rated Voltage Vishay Intertechnology introduced the new F339X2 305VAC series of Automotive Grade X2 electromagnetic interference (EMI) suppression film capacitors for standard across the line applications (50 Hz / 60 Hz). The F339X2 305VAC series is qualified to both...

Interview