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Skybox Security Introduces Threat–Centric Vulnerability Management for Virtual and Cloud Networks

Skybox Security
Skyboxä Security, a global leader in cybersecurity management, continues to expand its cloud security management solution, Skybox for the Cloud. The solution now includes threat–centric vulnerability management (TCVM) for virtual and multi–cloud environments and extends capabilities for security policy management, attack surface visibility and network path analysis. With one platform, the Skybox Security Suite, organizations are now able to...

SECU Members Increase Support for NC GreenPower’s Solar Schools Program

SECU Foundation
The member-funded State Employees’ Credit Union (SECU) is increasing its 2018-2019 support for NC GreenPower’s Solar Schools program – good news for North Carolina schools interested in participating in the solar energy initiative.  The SECU Foundation program renewal will provide a two-year $150,000 challenge grant for up to ten K-12 public schools to earn the opportunity for a solar...

Hawaiian Telcom Stockholders Overwhelmingly Approve Merger with Cincinnati Bell

Hawaiian Telcom
Hawaiian Telcom Holdco, Inc., Hawai‘i’s leading fiber-based integrated communications provider, announced that its stockholders voted overwhelmingly to approve the merger agreement with Cincinnati Bell during a special meeting held today. Approximately 99.8 percent of the shares voted were cast in favor of the merger, representing 86.2 percent of Hawaiian Telcom’s outstanding shares as of the record date of September 26,...

TTM Technologies, Inc. to Exhibit at International Printed Circuit & APEX South China Fair in Shenzhen, China

TTM Technologies
TTM Technologies, Inc., a global leader in printed circuit board (PCB) manufacturing, will be exhibiting at the annual International Printed Circuit & APEX South China Fair (2017 HKPCA & IPC Show) at Booth 1L01.  Themed "Global Wisdom Local Presence”, the Fair runs from December 6-8 and will be held at the Shenzhen Convention & Exhibition Center, China.  TTM's Sales...

NI Announces an Automated Solution for Turning Big Analog Data Complexities Into Insights

National Instruments
NI, the provider of platform-based systems that enable engineers and scientists to solve the world’s greatest engineering challenges, announced today the release of the Data Management Software Suite. This enterprise software solution offers a complete workflow to standardize measurement data across teams, mine that data for useful information, transform the data through automated analysis and deliver reports with valuable...

Fujitsu Launches New PRIMEQUEST Series, Boosts Processing Performance by up to 50%

PRIMEQUEST 3800E
Fujitsu announced the start of worldwide sales for its new mission-critical x86 Fujitsu Server PRIMEQUEST 3000 series, featuring the latest processors from the Intel Xeon processor Scalable family. The PRIMEQUEST 3000 series adopts the latest processors, with up to 28 cores per CPU and support for up to 8 CPUs (224 cores). Memory capacity has also been expanded to a...

Allegro MicroSystems Introduces New 0° to 360° Angle Sensor ICs

A1333-Angle Sensor ICs
Allegro MicroSystems, LLC introduces two new 0° to 360° angle sensor ICs that provide contactless high-resolution angular position information based on magnetic Circular Vertical Hall (CVH) technology. Allegro’s A1333 and A1339 devices include a system-on-chip (SoC) architecture that includes: a CVH front end, digital signal processing, and supports multiple digital output formats, including Allegros first motor commutation outputs (UVW), and encoder outputs (A, B, I)...

Mocana, Xilinx, Avnet, Infineon and Microsoft Join Forces to Secure Industrial Control and IoT Devices

Avnet UltraZed-EGTM SOM
Mocana, the leading provider of IoT security solutions for industrial control systems (ICS) and the Internet of Things (IoT), announced a partnership with Avnet, Xilinx, Infineon Technologies and Microsoft to introduce an integrated, high-assurance industrial IoT system that meets the latest cybersecurity standards. The system is comprised of advanced hardware and software built on the Avnet UltraZed-EG system-on-module (SOM), designed...

ASUS ZENFONE 3 MAX5.2 IS Now Available at Exciting New Price

ASUS
ASUS, the Taiwanese leader in mobile technology, announced attractive price reductions for ZenFone 3 Max 5.2 launched in July 2016.  Zenfone 3 Max 5.2 (ZC520TL), which was priced at INR 10,999 is now available for INR 9,999. ZenFone 3 Max 5.2 comes with 5.2" HD display, 13 MP rear camera, 5MP front camera, 4100 mAh battery with reverse charging and,...

LANXESS Tepex for car engine undertrays

LXS-IMG_Unterbodenverkleidung
Hard to beat  Significant weight savings Cost-effective material solution Major potential for protecting batteries in electric vehicles In regions where road surfaces are poor, vehicle underbodies are subjected to tough conditions, having to withstand the impact of stones thrown up from the surface and, in extreme cases, even direct contact with the ground. A major German car manufacturer is therefore...

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