Electronicsmedia

GLOBALFOUNDRIES today announced the establishment of Avera Semiconductor LLC, a wholly owned subsidiary dedicated to providing custom silicon solutions for a broad range of applications. Avera Semi will leverage deep ties with GF to deliver ASIC offerings on 14/12nm and more mature technologies while providing clients new capabilities and access to alternate foundry processes at 7nm and beyond. Avera Semi is built...

STPay-Boost IC combines hardware secure element with proprietary NFC-boost technology for superior contactless performance Fidesmo OTA personalization/tokenization platform completes the solution as a turnkey payment system-on-chip Compact single-chip form factor ideal for smart watches, wristbands, connected jewelry: confirmed by Swedish hybrid smart-watch maker Kronaby STMicroelectronics and Fidesmo, the contactless-services developer and Mastercard Approved Global Vendor, have created a turnkey...

Texas Instruments today announced the industry's first multiprotocol gigabit (Gb) time-sensitive networking (TSN)-enabled processor family. The new, highly integrated Sitara AM6x processor family provides industrial-grade reliability, with quad and dual Arm Cortex-A53 core variants built to meet the rapidly evolving needs of Industry 4.0 in factory automation, motor drives and grid infrastructure. For more information about Sitara AM6x processors, see www.ti.com/AM6x-pr. By supporting...

In today’s times, technology evolves really fast… the flip side, so do hackers. Armed with a deviously brilliant mind and superior knowledge of the latest technologies, hackers are breaching organization’s cybersecurity with such surprising ease that’s it’s worrisome. The latest victim of a sophisticated cyber fraud has been the Madhya Pradesh (MP) government. Dubbed as the ‘e-tender scam’, the fraud...

ON Semiconductor has extended the capabilities of its RSL10 family of Bluetooth 5 certified radio System-on-Chips (SoCs) with support for the Bluetooth SIG mesh networking standard.  In addition, the company has introduced a new PC software application with the RSL10 USB dongle. Alongside the recently-announced RSL10 SIP, the additional software and design support tools ease development and enable support for a broad range...

Viavi Solutions today introduced theTeraVM 5G Core Emulator solution, the first mobile core emulator compliant with 3GPP standards, empowering faster 5G network development and deployment. With this addition to the TeraVM family and RANtoCore portfolio, VIAVI enables complete, end-to-end 5G base station testing and validation, simplifying the development lifecycle of gNodeB (gNB) base stations for a more agile, 3GPP-compliant...

The 15th edition of NI Days conference successfully concluded in Bengaluru, India with theme of FUTURE FASTER. NI Days is the annual conference hosted by National Instruments. It brings together hundreds of engineers, scientist, industry key leaders, NI clients and vendors to discuss and showcase latest technologies for software defined systems under the Test and Measurement portfolio. National Instruments,...

Mouser Electronics, Inc., the industry's leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components, will exhibit at electronica 2018, at the Messe München exhibition grounds, November 13–16, to inspire attendees with innovative products, technologies, and ideas. The Munich event is the world’s leading trade fair and conference for electronics. Mouser is once again partnering...

Vishay Intertechnology announced its technology lineup for electronica 2018, taking place Nov. 13-16 at the Munich Trade Fair Centre in Munich, Germany. In its main booth C4.421-422 and Automotive Innovation booth B4.W07-W10 — both new locations for the company this year — Vishay will be exhibiting its latest industry-leading passive and semiconductor component, optoelectronic, and sensor technologies for a...

Infineon Technologies AG  adds another member to its family of intelligent power modules (IPMs): CIPOS Maxi IM818 series integrates various power and control components to increase reliability, optimize PCB size and system costs. The IPM is packaged in a DIP 36x23D housing. This makes it the smallest package for 1200 V IPMs with the highest power density and best...