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Molex Debuts MUO 2.5 Termination Connection

MUO_Circuit
Molex introduces the MUO 2.5 Termination Connector, designed to replace closed-end (CE) terminals. It will not only reduce cable assembly time for OEMs, but also improve reliability and processing time. “Traditional CE terminals can cause wire damage and cannot be disassembled after installation,” said Yujiro Enomoto, global product manager, Molex. “These innovative connectors move the wire grounding process to the final...

New Edition of Supply Chain Navigator from Avnet Features Maker Pioneer Dale Dougherty

Pioneer Dale Dougherty
In 2016, more than 1.4 million people attended one of the 191 Maker Faire events held worldwide. Since its 2009 launch, over $3.3 billion has been pledged to support makers and startups through the crowdfunding platform Kickstarter. Making has become a bona fide force within the global economy, and the October 2017 issue of Supply Chain Navigator, released today...

Power Converter Module Selection for Medical Equipment

Power Converter Module
When it comes to electronic medical equipment design there are many aspects to be considered but nothing is more important than the safety of the patient and the health care personnel attending to them. We examine the core requirements below - Isolation, insulation and withstand voltage - Almost all medical equipment will have contact with people and because of this the...

ercogener builds EMEA’s first Industry 4.0 modem using u‑blox LTE Cat M1 cellular technology

Industry 4.0 modem
u‑blox, a global leader in wireless and positioning modules and chips, is pleased to announce that ercogener, a global leader in industrial modems, has developed its first Industry 4.0 modem using u‑blox LTE Cat M1 cellular technology. The modem – the first to provide LTE Cat M1 cellular connectivity in EMEA – is designed to meet the requirements of the recently...

Mentor’s Tessent VersaPoint test point technology helps Renesas reduce cost and improve quality

mentor
Mentor, a Siemens business, announced the availability of the VersaPoint test point technology in its Tessent ScanPro and Tessent LogicBIST products, which maintain ISO 26262 qualification. The VersaPoint test point technology reduces manufacturing test cost and improves quality of in-system test – two critical requirements for high-reliability ICs in the automotive and other industries. Mentor is also announcing that...

Synopsys Introduces Complete Functional Safety Test Solution to Accelerate ISO 26262 Compliance for Automotive SoCs

Synopsys functional safety test solution
Highlights: Validated solution, including DesignWare STAR Memory System, DesignWare STAR Hierarchical System, DFTMAX LogicBIST software qualification kit, and ARC HS processor, ensures high test coverage for automotive systems DesignWare ARC HS processor functions as an on-chip safety manager for intelligent periodic and mission mode testing Test capabilities for embedded memories, logic blocks, and analog and mixed-signal IP provide high...

Molex Announces Grand Opening of Silicon Valley Technology Center

Molex
Highlights: City of Fremont vibrant locale for serving diverse customer base and co-developers Expands access to investment and global design resources Inspiring space showcases technology, capabilities and solutions Molex, a subsidiary of Koch Industries, has announced the official opening of a new technology center located in Fremont, California. The dedication ceremony, held on October 24, 2017, was attended by Molex...

Murata Broadens the Input and Output Ranges for Small DC-DC Converter

DC-DC Converter
Murata today debuted the latest addition to its MonoBlock type point-of-load (POL) product lineup, expanding input/output range while reducing the mounting area by 50 percent compared to Murata’s conventional models. The new MYSGK02506BRSR DC-DC converter delivers superior heat dissipation in a small form factor, while optimizing components in a module and enabling high current density. Production of this converter will be...

USB Smart Hub ICs Enable Smartphone-Connected Automotive Infotainment

USB Smart Hub ICs
With the rise in in-vehicle infotainment systems, car manufacturers need to provide a reliable, intelligent connection between the car’s display and one or more smartphones or tablets. Microchip Technology Inc., the industry leader in supplying the integrated circuits (ICs) that enable these connections, provides unrivaled options with its five new USB 2.0 smart hubICs. These devices,available in a variety...

Park Electrochemical Corp. Announces Election of Mark Esquivel as Senior Vice President-Aerospace

Park Electrochemical Corp.
Park Electrochemical Corp. announced the election of Mark Esquivel as Senior Vice President-Aerospace of the Company.  Mr. Esquivel also serves as President of the Company’s Park Aerospace Technologies Corp. aerospace materials, parts and assemblies manufacturing and design business unit located in Newton, Kansas and President of the Company’s Tin City Aircraft Works, Inc. aerospace design and development subsidiary also...

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