Electronicsmedia

Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced the development of its third-generation 32-bit RX CPU core, the RXv3. The RXv3 CPU core will be employed in Renesas’ new RX microcontroller (MCU) families that begin rolling out at the end of 2018. The new MCUs are designed to address the real-time performance and enhanced...

Fujitsu today announced the Japan launch of iCAD SX V7L7, the latest version of the Fujitsu Manufacturing Industry Solution iCAD SX, its 3D CAD software for industrial machinery design, incorporating a proprietary 3D CAD engine, the world's fastest. iCAD SX V7L7 delivers a huge boost in the processing performance of 3D data, making it ideal for systems such as large-scale...

Renesas Electronics Corporation is accelerating the development of robotics systems to deliver intelligence at the industrial endpoint by extending the features of Renesas’ high-performance, 32-bit RX65N Series of microcontrollers (MCUs) to support the DDS-XRCE (Data-Distribution Service for Extremely Resource Constrained Environments), one of the upcoming protocol standards for ROS 2 communication. Renesas’ support of the DDS-XRCE framework enables the...

National Instruments released NI Trend Watch 2019. The report examines the most crucial engineering trends and challenges of the changing technology landscape, including the Internet of Things (IoT), the progression of 5G technology from prototyping to commercial deployment and autonomous driving for the masses. "These engineering trends are disrupting industries and product testing, leading to complex, unprecedented challenges," said Shelley Gretlein, NI vice...

NetRack, a leading solution provider for data centers and end-to-end IT server racks, recently organized exclusive partners meet for all its East India Partners at Windflower Prakruthi Resort, Bengaluru. The partner's meet cum training program was conducted for 2 days which included the visit to Nethack's 'State-of-the-art' production facility. NetRack's partners associated with various verticals like government BFSI, IT/ITES, Hospitals...

• SAS has successfully completed the Critical Design Review ("CDR") for its Pearls nano-satellites and is now advancing the project to the construction and integration phase. • Significant milestone achieved with the presentation of key hardware and software requirements by SAS' aerospace partner GomSpace. • First launch of the "Pearls" remains on track for 2019, with successive launches to proceed in...

ROHM has recently announced the availability of a buck-boost power supply chipset that provides the lowest current consumption in the industry along with stable performance (transient response characteristics) in automotive ECUs (Electronic Control Units) for cluster panels and gateways used in start-stop vehicle systems. The chipset integrates a buck DC/DC converter with boost functionality (BD8P250MUF-C) and a dedicated boost IC...

Rohde & Schwarz and Huawei have successfully tested the interoperability of LTE-V connected vehicles with the R&S CMW500wideband radio communication tester using the embedded Huawei Balong 765 IC as an LTE-V UE. The solution verified multiple test scenarios for internet of vehicles (IoV) communications based on 3GPP Release 14 Mode 4. LTE-V is a cellular IoV technology standard based on device to device...

Texas Instruments introduced a new temperature sensor family that offers±0.1°C accuracy across a wide temperature range and helps simplify system design for industrial and medical applications. The TMP117 is the first single-chip temperature sensor to offer similar performance to platinum resistance temperature detectors (RTDs)while significantly reducing design complexity and power consumption, and the TMP117M, a digital temperature sensor for...

Infineon Technologies AG and XAIN have agreed to work together on bringing blockchain technology into the car. The Munich semiconductor maker and the Berlin-based start-up have signed a corresponding Memorandum of Understanding at Infineon’s 1st Automotive Cybersecurity Forum in Munich. The goal of the collaboration is to test possible applications and develop suitable ones to market maturity. A first...