Electronicsmedia

The 15th edition of NI Days conference successfully concluded in Bengaluru, India with theme of FUTURE FASTER. NI Days is the annual conference hosted by National Instruments. It brings together hundreds of engineers, scientist, industry key leaders, NI clients and vendors to discuss and showcase latest technologies for software defined systems under the Test and Measurement portfolio. National Instruments,...

Mouser Electronics, Inc., the industry's leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components, will exhibit at electronica 2018, at the Messe München exhibition grounds, November 13–16, to inspire attendees with innovative products, technologies, and ideas. The Munich event is the world’s leading trade fair and conference for electronics. Mouser is once again partnering...

Vishay Intertechnology announced its technology lineup for electronica 2018, taking place Nov. 13-16 at the Munich Trade Fair Centre in Munich, Germany. In its main booth C4.421-422 and Automotive Innovation booth B4.W07-W10 — both new locations for the company this year — Vishay will be exhibiting its latest industry-leading passive and semiconductor component, optoelectronic, and sensor technologies for a...

Infineon Technologies AG  adds another member to its family of intelligent power modules (IPMs): CIPOS Maxi IM818 series integrates various power and control components to increase reliability, optimize PCB size and system costs. The IPM is packaged in a DIP 36x23D housing. This makes it the smallest package for 1200 V IPMs with the highest power density and best...

DENSO Corporation, the world’s second largest mobility supplier, today announced it will establish a new facility at Haneda Airport in Tokyo to develop and test automated driving technologies. The facility, which is expected to be complete by June 2020, will feature a building and proving ground for mobility systems R&D and will advance DENSO’s worldwide efforts to create a...

Backed by 20 million hours of device reliability testing, high-voltage GaN FET with integrated driver and protection doubles power density in industrial and telecom applications Texas Instruments announced a new portfolio of ready-to-use, 600-V gallium nitride (GaN), 50-mΩ and 70-mΩ power stages to support applications up to 10 kW. The LMG341x family enables designers to create smaller, more efficient and...

ON Semiconductor is enabling more efficient inspection of smartphone displays with the introduction of a new 50 megapixel (MP) resolution charge-coupled device (CCD) image sensor. As the highest resolution Interline Transfer CCD image sensor commercially available, the KAI-50140 provides the critical imaging detail and high image uniformity needed not only for inspection of smartphone displays but also circuit board and mechanical...

Vishay Intertechnology, Inc. introduced a fully integrated proximity sensor that combines a high power vertical-cavity surface-emitting laser (VCSEL), a photodiode, a signal processing IC, and a 12-bit ADC in a single package. The new VCNL36687S is designed to be used in smartphones, tablets, virtual reality / augmented reality (VR / AR) headsets, and other battery-operated devices. With a range of up to...

Key technology of connected mobility: considerable growth expected on the automotive antenna market Acquisition follows a successful and long-standing relationship between Kathrein Automotive and Continental Board Member Helmut Matschi: "There would be no connectivity without antennas. High-performance intelligent antennas are the key technology for holistic vehicle connectivity." Continental takes over the entire workforce The technology company Continental is acquiring...

Third Quarter Highlights Third quarter net sales $1,144 million, up 7% sequentially Net Income $57 million, earnings per diluted share $0.24 EBITDA $235 million, up 13% sequentially Completed debt refinancing, reducing interest expense by $11 million annually TEMPE, Ariz.--(BUSINESS WIRE)--Oct. 29, 2018-- Amkor Technology, Inc. (NASDAQ: AMKR), a leading provider of semiconductor packaging and test services, today announced financial results for the third quarter ended September 30, 2018. "Third quarter...