Industry’s smallest logic parts approved for automotive announced by Nexperia
Nexperia announced, over twenty logic types in the company's space-saving leadless MicroPak packages are now AEC-Q100 qualified. These logic solutions are the smallest devices of their type suitable for automotive applications and Nexperia's Q100 portfolio exceeds the Automotive Electronics Council's requirements.
Nexperia's MicroPak packages feature the same silicon die as larger PicoGate options, ensuring that electrical performance remains identical to...
MACOM and STMicroelectronics Accelerate GaN-on-Silicon Support for 5G Wireless Network Buildouts
Wafer supply expansion to enable cost, scale, and industrialization of GaN-on-Silicon for the global 5G network buildout
Wide bandgap efficiency and gain to meet 5G antenna range and energy efficiency
MACOM Technology Solutions Holdings, Inc. and STMicroelectronics announced the 2019 expansion of 150mm GaN-on-Silicon production capacity in ST’s fabs, and 200mm as demand requires. The expansion is designed to service the worldwide...
Arm & China Unicom sign partnership agreement to drive IoT adoption in China
Arm and China Unicom announced a long-term partnership agreement to deliver IoT scalability, security and simplicity to Chinese enterprises and global companies looking to have a local presence in China. The collaboration will provide a flexible, high performance and secure solution by leveraging Arm Pelion Device Management,Arm Mbed OS, China Unicom's new IoT platform and a rich device and application ecosystem.
Pelion...
Blockchain-Based Data Monetization Platform for Sharing Vehicle Data
The technology company Continental and Hewlett Packard Enterprise announced a new platform, expected to be available in 2019, for sharing vehicle data to enable new digital services that improve driver safety and convenience. At the same time the platform will help car manufacturers monetize their data and differentiate their brands. Based on blockchain technology, the platform provides data sovereignty,...
Electrolube Launch New Encapsulation Resins at India align with local customers’ requirements
Electro-chemicals and circuit protection specialist, Electrolube are returning to India Electronics Week 2019 to showcase new encapsulation resins, thermal management products and conformal coatings on their booth (I32) Bengaluru, India, February 26-28 2019.
Based in Bangalore, Electrolube India is currently one of the group’s fastest growing subsidiaries and operates as an independent local enterprise with sales, manufacturing and technical support.
Using...
Independent security certification for IoT devices unveiled by Arm & leading test laboratories
Arm and leading security testing labs collaborate to provide independent evaluation of Platform Security Architecture (PSA) implementations in IoT devices
Arm, Brightsight, CAICT, Prove&Run, Riscure and UL establish PSA Certified™ to build trust in connected devices and grow IoT deployment
To support the widespread deployment of secure IoT solutions based on the Platform Security Architecture (PSA) framework, Arm and...
Aricent will work collaboratively to create common & open source edge computing architectures
Aricent announced that it has joined The Linux Foundation's LF Edge project as a Premier Member. LF Edge works to establish an open, interoperable framework for edge computing independent of hardware, silicon, cloud or operating system, to ultimately form a software edge that brings together the best of cloud, telecom, IoT and enterprise markets.
Aricent has established a track record of delivering...
R&S Cable Rider ZPH cable & antenna analyzer portfolio with a two-port model
Field engineers often need multiple instruments to perform antenna installation and maintenance tasks: a cable and antenna analyzer, a spectrum analyzer, a signal generator and a bias source. Rohde & Schwarz now enhances its R&S Cable Rider ZPH portfolio with a two-port model, which combines all of these instruments plus additional features into one powerful handheld unit ideal for use in...
REAL3 Time-of-Flight image sensor with HVGA resolution for high quality photo effects & more
Infineon Technologies AG is presenting the fourth generation of its REAL3 image sensor IRS2771C at Mobile World Congress 2019 in Barcelona, Spain. The 3D Time-of-Flight (ToF) single chip is especially designed to meet the requirements of the mobile consumer device market and, in particular, demand for higher resolutions with small lenses. The wide range of use cases includes secure...
Infineon launches partner network to advance Voice User Interface in connected devices
From smart speakers to smart TVs, conferencing systems or smart home appliances: operating an electronic device is much easier and more intuitive with speech recognition. Consequently, demand for voice user interfaces (VUI) in electronic devices is increasing dramatically. Market researchers expect that the smart speaker market alone will grow 20 percent per year on average.
Premium MEMS microphones and cutting-edge...

















