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STMicroelectronics New Galvanic Isolated High-Side Smart Power Switch with SPI for Industry 4.0

smart power switch
The STMicroelectronics ISO8200AQ galvanic isolated octal high-side smart power switch enhances diagnostics and system management by providing a 20 MHz SPI port allowing both per-channel over-temperature signalization and efficient daisy-chaining of multiple devices. A power-good output indicates the status of the process-side power supply. The device enlarges ST's family of galvanic isolated high-side switches, featuring maximum safety and robustness in demanding applications...

Focusing on R&D in AI & Automation, Ericsson established innovation hub in India

AI R&D in India
Ericsson has set up a Global Artificial Intelligence Accelerator (GAIA) in Bengaluru, India. This innovation hub set up by Ericsson in India will focus on research and development in Artificial Intelligence (AI) and Automation. This newly launched GAIA facility will be key in accelerating the execution of Ericsson’s focused strategy by leveraging cutting edge AI and Automation technologies to...

Mouser Electronics Sponsors IITs Technical Fest for Second Year

IITs Technical Fest for Second Year
Mouser Electronics, Inc., the New Product Introduction (NPI) leader that empowers innovation, will be a major sponsor at the upcoming Indian Institutes of Technology (IITs) annual technical festivals. Mouser representatives will participate as Electronic component sponsors at Asia's largest science and technology festival, Techfest at IIT Bombay, Dec. 14 – 16, followed by Shaastra at IIT Madras, the first...

New LTR50 Series of Wide Terminal Low-Ohmic High Power Thick-Film Chip Resistors Delivers Industry-Leading TCR Characteristics

ROHM has recently announced the availability of a new lineup of high power wide terminal thick-film chip resistors (10-910mΩ) ideal for current detection in a variety of applications, including inverters, AC, and energy-efficient appliances. A thorough review of the resistive material allowed ROHM to improve rated power to 2W in the compact 2550 size (2.5x5.0mm, t=0.55mm) -- 4x higher than...

Smallest data converters deliver high integration and performance

Texas Instruments introduced four tiny precision data converters, each the industry’s smallest in its class. The new data converters enable designers to add more intelligence and functionality while shrinking system board space. The DAC80508 and DAC70508 are eight-channel precision digital-to-analog converters (DACs) that provide true 16- and 14-bit resolution, respectively. The ADS122C04 and ADS122U04 are 24-bit precision analog-to-digital converters...

Autotalks Validates C-V2X Chipsets Using Rohde & Schwarz Equipment

Amos Freund VP R&D at Autotalks. Photo credit - Daniel Danilov
Autotalks, a world leader in V2X (Vehicle to Everything) communication solutions and Rohde & Schwarz, a leading supplier of test and measurement solutions to the wireless industry, validate first-ever global C-V2X chipsets. Announced last September, Autotalks' deployment-ready, second-generation V2X chipset is the only available solution capable of supporting both DSRC and C-V2X (also known as LTE-V2X or LTE-V) direct communications (PC5 protocol) at the highest security...

MIPI released I3C Basic Interface Specification for broader developer community

MIPI A-PHY Compliance Program
The MIPI Alliance, an international organization that develops interface specifications for mobile and mobile-influenced industries, released MIPI I3CBasic v1.0, a subset of the MIPI I3C specification that bundles the most commonly needed I3C features for developers and other standards organizations. Released in January 2017, MIPI I3C v1.0 streamlines and advances interface technologies for connecting processors, sensors and many other devices that had previously used I2C (Inter-Integrated Circuit), the...

New Smart Home Platform Drives the Battery-Powered IoT Device Trend

Wireless Gecko Platform
Silicon Labs launches the next-generation Z-Wave 700 on the Wireless Gecko platform, the industry's most comprehensive hardware and software connectivity solution for the Internet of Things (IoT). Z-Wave 700 delivers on Silicon Labs' vision and platform integration roadmap following the company's strategic acquisition of Z-Wave technology in April 2018. The new smart home platform builds on Z-Wave's industry-leading S2 security and interoperability...

First implementation of the new NATO standard: Rohde & Schwarz awarded order from Royal Danish Navy for BRASS EO

R&S Series4100 software defined radios
The Danish Navy is relying on Rohde & Schwarz to implement NATO's Broadcast and Ship Shore Enhancement One (BRASS EO) architecture for state-of-the-art HF communications. The technology group has been contracted to provide a comprehensive single-source solution that includes the communications system and a comprehensive service package. Life cycle costs were also a key part of the evaluation process. Rohde &...

World’s first industrial-grade eSIM in miniaturized package by Infineon

Embedded SIM
Machine-to-machine communication in the Internet of Things (IoT) requires reliable data collection and uninterrupted data transmission. For taking full advantage of the ubiquitous mobile networks, Infineon Technologies AG provides the world’s first industrial-grade embedded SIM (eSIM) in a miniature Wafer-level Chip-scale Package (WLCSP). Manufacturers of industrial machines and equipment ranging from vending machines to remote sensors to asset trackers...

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