Electronicsmedia

Worldwide semiconductor revenue hits record $129.8 billion in Q3 2018 The global semiconductor industry revenue grew 7.4 percent sequentially in the third quarter of 2018, reaching a record $129.8 billion. Semiconductor growth occurred in all application markets and world regions. Samsung Electronics continued to lead the overall semiconductor industry market in the third quarter, with 16.2 percent share, followed by Intel at...

Leti, a research institute of CEA-Tech, and Silvaco Inc., a leading global provider of software, IP and services for designing chips and electronic systems for semiconductor companies,  announced during the IEDM 2018 conference a project to create innovative and unified SPICE compact models for the design of advanced circuits using nanowire and nanosheet technologies. The new predictive and physical compact...

The moto for Elexcon 2018 is the“Witness True China’s Electronic Innovation". The annual event, held at the Shenzhen Convention and Exhibition Center from December 20 to 22, 2018, will feature cutting edge technologies including AI, 5G, smart home, IoT, smart driving, new energy, and intelligent systems. Elexcon 2018 will feature three technology hubs all aimed at the current industry...

Mouser Electronics, Inc., the authorized global distributor with the newest semiconductors and electronic components, is now stocking the BMI088 high-performance inertial measurement unit (IMU) from Bosch Sensortec. Borrowing from Bosch's proven automotive technology, the Bosch BMI088 delivers an extremely stable, low-noise 6-axis inertial sensor designed for industrial and harsh-environment drone and robotics applications. The Bosch BMI088 IMU, available from Mouser Electronics, incorporates a 16-bit digital, triaxial accelerometer, and a 16-bit digital, triaxial gyroscope to accurately...

Wearable-ready SoC combines with digital and analog audio, dedicated camera interface, plus GNSS and sensor fusion RS Components is boosting opportunities to create smarter IoT devices by introducing Sony SPRESENSE, featuring Arm Cortex-M4F performance and extensive sensing, audio, and imaging capabilities. The low-power SPRESENSE platform, comprising a 50.0mm x 20.6mm main board and 68.6mm x 53.3mm extension board, combines the Sony CXD5602 system-on-chip...

Fairview Microwave has expanded their line of RF coaxial probes into the 40 GHz frequency range for use in high-speed communications, microwave components and networking applications. Fairview Microwave’s expanded line of coaxial RF probes now includes four models that deliver 10 dB maximum return loss over a broad frequency range of DC-40 GHz. These new RF probes are offered in GS and...

Texas Instruments (TI)  introduced a new family of LED drivers with integrated, independent color mixing, brightness control and a power-saving mode. The LP5018, LP5024, LP5030 and LP5036 enable smooth, vivid color and reduce system power consumption. The devices are the industry’s first to offer a 29-kHz dimming frequency, above human-audible range, to help designers of applications that use a human-machine...

CommAgility announced the CA-K2L-RF2, a standalone high performance processing module that includes ARM- and DSP-based cores with two integrated wideband RF transceiver channels. Based on CommAgility's existing AMC-K2L-RF2 board, the new CA-K2L-RF2 module provides a competitively-priced option to provide LTE and LTE-Advanced capabilities in private, customized and specialized networks. It measures 175mm (L) x 122mm (W) x 28mm (H), making it...

GLOBALFOUNDRIES announced its advanced silicon germanium (SiGe) offering, 9HP, is now available for prototyping on the company's 300mm wafer manufacturing platform. The move signifies the strong growth in data center and high-speed wired/wireless applications that can leverage the scale advantages of a 300mm manufacturing footprint. By tapping into GF's 300mm manufacturing expertise, clients can take advantage of increased production efficiency and...

Ericsson Connected Vehicle Cloud (CVC) platform with global operational support to benefit Volvo Car Group worldwide market Ericsson and Volvo Cars signed first Connected Vehicle Cloud deal in 2012 Industrialized Ericsson Connected Vehicle Cloud platform can benefit all automotive players Ericsson has been selected by Volvo Car Group (Volvo Cars) to provide the industrialized Ericsson Connected Vehicle Cloud (CVC)...