Delivering Resilient Connectivity for AI
Cisco EVP and CPO Jeetu Patel recently shared how service providers and hyperscalers must rethink their architectures to deliver the future of global connectivity in the AI era. As we head to the OFC conference next week, AI transformation will certainly be a hot topic, as it increasingly demands high-speed interconnects between data centers—and within data centers—that only fiber optics can...
OFC 2025: Scintil Photonics showcases LEAF LightTM, world’s first single-chip, multi-wavelength laser source for DWDM co-packaged optics in AI datacenters
Reducing power consumption, while increasing networking bandwidth and reach, is a critical priority for AI datacenters. LEAF Light remote laser source demonstrates industry leading cost, size, channel spacing and power efficiency to enable co-packaged optics interconnects in AI datacenters Scintil Photonics will demonstrate LEAF Light, designed for DWDM co-packaged photonic interconnects, at booth 6357 during OFC exhibition, Moscone...
The Future of Battery Technology: Innovations Powering a Sustainable World
Battery systems are more than just a component in our gadgets. They are at the heart of how we interact with technology, renewable energy, and transportation. With the global push for clean energy and electric vehicles (EVs), the future of battery technology holds immense promise. What advancements are on the horizon? Let’s take a closer look.
Advanced InSb Hall Element Sensors from Diodes Incorporated for Rotation and Current Detection Applications
Diodes Incorporated (Diodes) introduces its first series of advanced InSb Hall element sensors for rotation speed detection and current measurement in consumer applications such as laptops, mobile phones, joysticks, and in motors found in various home appliances. In industrial applications, they are designed for use in position encoders and commutation of brushless motors and fans. The development...
Indium Corporation to Showcase Innovative Materials Powering AI Technology at Productronica China
As a proven leader in Metal-Based Thermal Interface materials solutions for future-forward technologies, Indium Corporation will proudly showcase its portfolio of thermal interface materials (TIMs) that enabling AI advancements at Productronica China, March 26-28, in Shanghai, China.
Indium Corporation's GalliTHERM portfolio of gallium-based liquid metal solutions builds on more than 60 years of expertise in manufacturing advanced...
DigiKey Announces Sponsorship of KiCad to Support Open-Source EDA Development
DigiKey, a leading global commerce distributor offering the largest selection of technical components and automation products in stock for immediate shipment, is proud to announce its continued sponsorship of KiCad, the leading open-source Electronic Design Automation (EDA) suite, reinforcing a shared commitment to advancing open-source tools for the electrical engineering community.
KiCad’s mission is...
Renesas Introduces Low-Power Bluetooth Low Energy SoC for Automotive Applications
Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, introduced a new industry-leading Bluetooth chip that combines a radio transceiver, an Arm M0+ microcontroller, memory, peripherals and security features in a compact SoC design. The DA14533, the first automotive-qualified device in the company's Bluetooth Low Energy system-on-chip (SoC) family, includes advanced power management features to simplify...
Neural Potential: Mouser Series Explores Brain-Computer Interfaces at the Intersection of Technology and the Mind
Mouser Electronics, Inc., the authorized global distributor with the newest electronic components and industrial automation products, announced the release of the latest installment of the Empowering Innovation Together (EIT) technology series, which examines the rapidly evolving field of brain-computer interfaces (BCIs). This series takes a deep dive into the engineering challenges and opportunities in the development of...
Safeguarding Data for the Quantum Era
In today's ever-evolving cybersecurity landscape, staying ahead of potential threats is a constant challenge. Advanced persistent threats, ransomware, and wipers are just a few risks organizations must guard against.
However, quantum computing is one of the most complex and far-reaching challenges on the horizon. Thanks to their ability to perform complex calculations exponentially faster than...
Würth Elektronik expands its STAR-TEC and STAR-TEC LFS snap ferrite families
Snap ferrites, developed in-house with technology using keys for retroactive cable noise suppression, are among the products that have made Würth Elektronik so well-known. The STAR TEC and STAR-TEC LFS product families have since grown: There is now a ferrite available for cable diameters of 2 to 3 mm that features all the proven practical benefits familiar from Würth Elektronik snap...