DigiKey Expands In-Stock Line Card in Q1 2026 with 31,000+ New Parts and 97 Suppliers
DigiKey Expands In-Stock Line Card in Q1 2026 - DigiKey, the global distribution leader of electronic components and automation products, added nearly 31,000 new stocking products available for fast shipment in Q1 2026. In total, over 387,000 new products were added to the DigiKey system, along with 97 new suppliers across its core business, Marketplace and Fulfilled by...
Why Industries Trust 22F-RF026-CL Allen-Bradley Line Filter for Motor Drives?
Trust 22F-RF026-CL Allen-Bradley Line Filter - In modern industrial environments, motor drives play a major role in ensuring smooth operations, energy efficiency, and reliable machine performance. From manufacturing plants to water treatment facilities, industries depend on motor drives to control speed, torque, and overall system productivity. However, with high-performance drives comes the challenge of electrical noise, voltage...
CEA-Leti Hybrid Bonding Technologies Driving Next-Gen 3D Integration at ECTC 2026
CEA-Leti Hybrid Bonding Technologies - CEA-Leti will present seven papers and posters on technologies shaping the next decade of advanced heterogenous integration at the Electronic Components and Technology Conference (ECTC) May 26-29 in Orlando, Fla.
These developments cover a variety of technologies, including reducing interconnect pitches through hybrid bonding interconnection, for low-temperature processes, superconducting...
TR7950Q SII Wafer Inspection Platform: AI-Powered Advanced Metrology for Semiconductor Manufacturing
TR7950Q SII Wafer Inspection Platform - Test Research, Inc. (TRI), the leading provider of Test and Inspection solutions for the electronics manufacturing industry, is proud to announce the launch of the TR7950Q SII Series. This highly modular platform is a dedicated solution for Back End Process and Advanced Packaging Inspection, ranging from patterning to wafer saw, and...
ViTrox Semiconductor Inspection Systems at SEMICON Southeast Asia 2026: Advanced AI Wafer, Die & Packaging Solutions
ViTrox Semiconductor Inspection Systems - ViTrox, which aims to be the World’s Most Trusted Technology Company in providing innovative, advanced, and cost-effective automated Machine Vision Inspection Solutions for the semiconductor and electronics packaging industries, is pleased to announce its participation in SEMICON Southeast Asia 2026. The exhibition will be held from 5 to 7 May 2026 at...
PEMTRON X-ray Inspection and Metrology Systems to Be Showcased at JPCA Show 2026
PEMTRON X-ray Inspection and Metrology Systems - PEMTRON, an inspection equipment developer and supplier, will exhibit at the JPCA Show 2026, taking place June 10–12 at Tokyo Big Sight in Tokyo, Japan. Visitors can find PEMTRON at Booth No. 1A-14.
At the show, PEMTRON will highlight its JUPITER 3D X-ray Inspection System, designed to...
Amphenol RF Expands Non-Magnetic MCX Connectors for Medical and Quantum Applications
Non-Magnetic MCX Connectors - Amphenol RF is pleased to announce the expansion of our non-magnetic MCX product series with additional coaxial connector configurations. These connectors are designed with non-ferrous materials and plating to eliminate magnetic interference in sensitive applications. Non-magnetic MCX connectors provide the same high-performance as standard options and are ideal for demanding environments such as...
Teledyne FLIR Defense Grows Third-Party Payload Integration Program, Adds Emesent Hovermap LiDAR for Unmanned Air, Ground, and Detection Platforms
Emesent Hovermap LiDAR - Unveiled at Modern Day Marine 2026, Teledyne FLIR Defense announced the expansion of its Third-Party Payload Integration Program with the certification of Emesent's Hovermap LiDAR Payload. The agreement will deliver Emesent's GPS-denied 3D-mapping capabilities across Teledyne FLIR's unmanned aerial systems (UAS), ground robots, and radiation detection platforms.
The Emesent–Teledyne FLIR combination addresses a GPS-denial gap in air and ground domains...
ROHM Launches an Ultra-Compact Wireless Power Chipset for Wearables
Ultra-Compact Wireless Power Chipset - ROHM has developed a wireless power supply IC chipset consisting of the receiver - ML7670 - and transmitter - ML7671 - compatible with Near Field Communication (NFC) technology for compact wearables such as smart rings and smart bands as well as peripheral devices like smart pens.
The smart ring market has seen rapid...
FLIR Test and Measurement Tools: New Extech Moisture Meters, BR95 Borescope & VP54 Voltage Detector Launched
FLIR Test and Measurement Tools - Flir, a Teledyne Technologies brand, a global leader in intelligent sensing solutions, today announced the launch of a new lineup of Extech moisture meters, the Extech BR95 Video Borescope with modular environmental sensors, and the Flir VP54 Non-Contact Voltage Detector—expanding its portfolio of accessible, professional-grade test and measurement solutions.
















