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Naprotek: Powering the Future of Space Exploration

Naprotek
Naprotek, LLC, a leading provider of mission-critical electronics technology solutions, proudly celebrates a landmark year in the space industry. In 2024, Naprotek advanced manufacturing capabilities played a vital role in 18 successful space launches, reinforcing the company’s commitment to innovation and excellence in space technology. Naprotek has solidified itself as a trusted partner to...

Seika Machinery Presents Webinar on Mechanical Stress Measurement for PCB Assembly and Mounting Process

Seika James Hara
Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, will host an insightful webinar titled "Importance of Mechanical Stress Measurement for PCB Assembly and Mounting Process" on Wednesday, March 5, 2025 at 1:00 PM EST. The event will be presented by James Hara of Kyowa Americas, an expert in strain gage measurement and...

Spirent Collaborates with CEWiT to drive India’s Bharat 6G Vision with Advanced Testing and Emulation

India's Bharat 6G Vision
Spirent Communications, announced its collaboration with the Centre of Excellence in Wireless Technology (CEWiT) to help support the Indian government’s ambitious “Bharat 6G Vision” to position India as a global leader in 6G technology. CEWiT is an autonomous research society of the Indian Institute of Technology Madras (IITM), and the collaboration sees Spirent’s technology being utilized to...

Introducing SAMA7D65 Microprocessors Available in System-in-Package and System-on-Chip with Advanced Graphics and Connectivity Features

SAMA7D65 MPUs
Embedded developers must address the challenge of designing systems that achieve a balance between compactness, energy efficiency and high performance. As applications grow more sophisticated with demands for advanced graphics and connectivity, offering multiple solutions ranging from SoCs to SiPs and SOMs simplifies and accelerates development timelines. Microchip Technology announces its portfolio of SAMA7D65 MPUs based on...

RK3576 IPC BOX: Elevating Edge Computing & Commercial Display Solutions

RK3576 IPC BOX
MYIR has introduced the MYD-LR3576-B IPC Box, following the launch last year in early November of the MYC-LR3576 System-on-Module (SoM). This IPC Box offers an excellent solution for edge computing and commercial display applications. The MYD-LR3576-B IP BOX integrates the MYD-LR3576 Development Board into a rugged, fanless enclosure, powered by the RK3576 octa-core processor...

New Vishay Intertechnology High Voltage MLCCs Deliver Extended Capacitance for Commercial Applications

VJ….W1HV High Voltage MLCC
Vishay Intertechnology, Inc. introduced a new series of surface-mount multilayer ceramic chip capacitors (MLCCs) for high voltage commercial applications. Offered in seven case sizes ranging from 1206 to 2225, VJ….W1HV High Voltage MLCC Commercial Series devices extend the capacitance values of the company's existing high voltage MLCCs with the ultra stable C0G (NP0) dielectric and are also available with...

Modernizing Industrial Networks: The Business Case for IT/OT Collaboration

Modernizing Industrial Networks
New report from Harbor Research examines how leaders are accelerating IT/OT partnerships for significant operational and financial benefits “From 2018-2023, cybersecurity attacks involving critical infrastructure in manufacturing, utilities, transportation systems and similar mission critical domains almost doubled year over year driving an average compound annual growth rate of over 90% per year.” – Harbor Research,...

DigiKey and Qorvo Announce Global Distribution Agreement

DigiKey Qorvo Partnership
DigiKey, a leading global commerce distributor offering the largest selection of technical components and automation products in stock for immediate shipment, and Qorvo, a leading global provider of connectivity and power solutions, announced a worldwide distribution agreement. This collaboration will further enhance the awareness, availability and speed of delivery of Qorvo's high-performance solutions to customers around the...

Streamlining Multi-Platform Collaboration With Tech Solutions

Multi-Platform Collaboration
Modern software solutions create direct team connections, eliminating barriers across offices, homes, and time zones. Organizations that can smoothly move between communication channels, document management systems, and track task interfaces can complete projects faster, reduce miscommunication, and keep their teams engaged. Teams can also fix bugs more quickly, respond to client requests sooner, and spend less time...

Danisense expands rapid prototyping capabilities with advanced winding machines to accelerate R&D innovation

Danisense winding machines
Key points: Danisense expands rapid prototyping capabilities with integration of advanced winding machines Highly customized coil configurations can now be produced in-house Streamlined development processes and reduced time-to-market for new products Danisense, the leader in high-accuracy current sense transducers for demanding applications,...

Interview