Electronicsmedia

Mouser Electronics, Inc., the industry's leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components, is now stocking the VITA 87 High-Density Circular MT Connectors from TE Connectivity. TE Connectivity's VITA 87 High-Density Circular MT Connectors enable the high speed and bandwidth needed in a smaller space for next-generation ruggedized systems. These...

The latest enhancements extend the reach of ‘Team Mode’ – which already provides security management across multiple physical locations – to buses, taxis, trucks, and other vehicles. Other improvements include the addition of Motion Detection 2.0, which brings deep learning intelligence to the system, better alarm video backup, and more. Here’s a brief overview...

NXP Semiconductors, an innovator and supplier of Ultra-Wideband (UWB) solutions, and Rohde & Schwarz collaborate to demonstrate a test setup for UWB radar target simulation at the upcoming Mobile World Congress in Barcelona. The demonstration, being the first of its kind, verifies the unique performance of the NXP Trimension™ NCJ29D6A chipset including the enhanced radar algorithms. It...

Rohde & Schwarz, in collaboration with NVIDIA, has achieved a significant breakthrough in AI-driven wireless communication research. The latest proof-of-concept to be showcased at MWC 2025 in Barcelona leverages digital twin technology and high-fidelity ray tracing for more realistic testing of neural receivers for 5G-Advanced and 6G. Rohde & Schwarz continues to push the...

The contract awarded includes the integration and deployment of an advanced simulator for orbital mechanics training, with GMV also providing maintenance and instructions on use This project strengthens GMV’s leadership in the development and integration of space surveillance, command, and control systems for both civilian and military applications in Europe Through...

ROHM has developed 650V GaN HEMTs in the TOLL (TO-LeadLess) package: the GNP2070TD-Z. Featuring a compact design with excellent heat dissipation, high current capacity, and superior switching performance, the TOLL package is increasingly being adopted in applications that require high power handling, particularly inside industrial equipment and automotive systems. For this launch, package manufacturing has been outsourced...

AAEON's UP brand this week confirmed the release of the UP Squared 7100 Edge, its fourth generation of Mini PC based on the compact UP Squared (85.6mm × 90mm) developer board. The UP Squared 7100 Edge comes equipped with either the Intel® Processor N97 or Intel® Processor N100 as its default CPU, a substantial...

Naprotek, LLC, a leading provider of mission-critical electronics technology solutions, proudly celebrates a landmark year in the space industry. In 2024, Naprotek advanced manufacturing capabilities played a vital role in 18 successful space launches, reinforcing the company’s commitment to innovation and excellence in space technology. Naprotek has solidified itself as a trusted partner to...

Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, will host an insightful webinar titled "Importance of Mechanical Stress Measurement for PCB Assembly and Mounting Process" on Wednesday, March 5, 2025 at 1:00 PM EST. The event will be presented by James Hara of Kyowa Americas, an expert in strain gage measurement and...

Spirent Communications, announced its collaboration with the Centre of Excellence in Wireless Technology (CEWiT) to help support the Indian government’s ambitious “Bharat 6G Vision” to position India as a global leader in 6G technology. CEWiT is an autonomous research society of the Indian Institute of Technology Madras (IITM), and the collaboration sees Spirent’s technology being utilized to...