CES 2025: Rohde & Schwarz unveils cutting-edge automotive testing innovations, to ADAS, electric drivetrain and connectivity
For the first time in the US, Rohde & Schwarz will show a radical innovation in automotive radar testing. The new R&S RadEsT automotive radar tester is a compact, versatile radar target simulator that meets the full range of testing needs – from lab-based functional testing to vehicle-level production checks and beyond. Visitors can learn how to streamline radar...
n-hop technologies Limited and OneAsia Network Limited Partner to Revolutionize Data Transfer and Networking Solutions
n-hop technologies Limited, a leader in telecommunications and computer networking innovations, and OneAsia Network Limited (OneAsia), the AI factory enabler with data centres across APAC, have signed a Memorandum of Understanding (MOU) to collaborate on pioneering large data transfer solutions and AI Data Centre networking technologies.
This partnership establishes a strategic framework to integrate...
AAEON’s New uCOM-IMX8P Brings RISC Computing to its SMARC Module Portfolio
AAEON, a leader in industrial IoT and AI Edge solutions, has released the uCOM-IMX8P, a versatile SMARC 2.1 compliant CPU module built on the NXP i.MX 8M Plus platform.
Following the release of the x86-based uCOM-ADN earlier this year, the uCOM-IMX8P is AAEON’s first module on the 82mm x 50mm SMARC form factor to...
Overcoming Technological Hurdles through Collaborative Innovation
Collaboration is at the core of technological innovation and advancement. Even industry titans like Tim Cook and Sam Altman may be known as leading figures in their respective tech fields, but, in reality, both would admit that it is their team’s hard work that produces breakthroughs in the world of artificial intelligence and consumer electronics.
Texas Instruments CC335x SimpleLink Dual-Band Wi-Fi 6 Companion IC, Now at Mouser Electronics
Mouser Electronics, Inc., the industry's leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components, is now stocking the CC335x SimpleLink dual-band Wi-Fi 6 companion ICs from Texas Instruments.
The Texas Instruments CC335x SimpleLink Wi-Fi Companion ICs offer Wi-Fi 6 and Bluetooth Low Energy (BLE) 5.4 while maintaining compatibility with Wi-Fi 4 (802.11 a/b/g/n) and Wi-Fi...
Microchip Adds MTCH2120 to its Portfolio of Turnkey Capacitive Touch Controllers
Turnkey touch controllers are a fast and easy way to upgrade from mechanical buttons to modern touch buttons or displays. With the launch of its 12-button MTCH2120 touch controller, Microchip Technology (Nasdaq: MCHP) is providing designers with a straightforward pathway for implementing touch button capabilities on user interfaces. The low-power, water-tolerant turnkey touch device is integrated with...
Continental Sets Out Plan for Automotive Spin-off and Initiates Sale of ContiTech’s OESL Unit
Highlights:
Future independent entity Automotive to be listed on the Frankfurt stock exchange as a European company (Societas Europaea, SE) led by Philipp von Hirschheydt
Wolfgang Reitzle, chairman of Continental's Supervisory Board: "The Automotive spin-off will unlock new strengths, because focused companies are more agile, especially in times of...
Vishay Intertechnology Precision Thin Film MELF Resistors Reduce Component Counts to Save Space, Simplify Designs, and Lower Costs
Vishay Intertechnology, Inc. introduced an enhanced resistance range for precision versions of its AEC-Q200 qualified thin film MELF resistors in the 0102, 0204, and 0207 case sizes. Designed to meet the needs of applications with high stability and reliability requirements, the Vishay Beyschlag MMU 0102, MMA 0204, and MMB 0207 are now available with low TCR down to ±...
Power Integrations Targets 800 V Automotive Applications with New Wide-Creepage Switcher IC
Power Integrations, the leader in high-voltage integrated circuits for energy-efficient power conversion, introduced a wide-creepage package option for its InnoSwitch3-AQ flyback switcher IC for automotive applications. A wide drain-to-source-pin creepage distance of 5.1 mm eliminates the need for conformal coating, making the IC compliant to the IEC60664-1 standard in 800 V vehicles while simplifying manufacturing and increasing system reliability.
STMicroelectronics introduces first STM32-ready wireless IoT modules leveraging collaboration with Qualcomm
STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, has introduced the first product of its strategic collaboration with Qualcomm Technologies to simplify development of next-generation wireless solutions for industrial and consumer IoT applications. The collaboration aims to deliver initially IoT modules leveraging ST's powerful STM32 ecosystem and Qualcomm Technologies' leading wireless connectivity solutions.

















