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Microchip’s RTG4 FPGAs with Lead-Free Flip-Chip Bumps Achieve Highest Space Qualification

RTG4 FPGAs
Satisfying mission assurance requirements for the most critical space programs, Microchip Technology’s Radiation-Tolerant (RT) RTG4 Field- Programmable Gate Arrays (FPGAs) with lead-free flip-chip bumps have earned the Qualified Manufacturers List (QML) Class V status. As designated by the Defense Logistics Agency (DLA), QML Class V is the highest level of qualification for space components and a necessary step to...

Energizing Tomorrow: Career Opportunities in the Battery Industry with ESSCI

Mr. Saleem Ahmed
In an era marked by rapid technological advancements and an increasing focus on sustainability, battery systems have emerged as a cornerstone of innovation. From electric vehicles to renewable energy storage, battery technology plays a crucial role in powering our future. As the demand for efficient, long-lasting energy storage solutions grows, so does the need for skilled professionals...

9 out of 10 cyberattacks happen because of human vulnerability

social engineering
Social engineering attacks pose a significant threat to businesses and individuals alike. They manipulate emotions instead of targeting technical vulnerabilities. These sophisticated attacks can lead anyone to reveal sensitive data, unknowingly help cybercriminals bypass security measures, or install malware.  Cybercriminals often impersonate trusted entities, such as IT support staff, employees of reputable companies, or...

Ministry of Electronics and Information Technology’s (MeitY) Digital India Innovation Zone at India Mobile Congress (IMC) 2024

India Mobile Congress
The National e-Governance Division (NeGD), Ministry of Electronics and Information Technology (MeitY) has set up a pavilion, ‘Digital India Innovation Zone’, at India Mobile Congress (IMC) 2024 to provide hands-on experience to the delegates on India’s various Digital Public Infrastructure (DPIs). The Prime Minister, Shri Narendra Modi inaugurated the 8th edition of India Mobile Congress at Bharat Mandapam...

Pasternack Expands Options for Low-Loss and Low-PIM Cable Assemblies

Low-Loss and Low-PIM Cable Assemblies
Pasternack, an Infinite Electronics brand and a leading provider of RF, microwave and millimeter-wave products, has launched new options for low-loss and low-PIM cable assemblies. The new offerings feature a variety of LMR cable assemblies and low-PIM configurations designed to meet the growing demand for superior signal transmission and minimal interference. The expanded line includes...

Indium Corporation to Showcase Solder Products, New Flux-Cored Wire Formula at SMTA International

Indium Corporation
As one of the leading materials providers in the electronics assembly industry, Indium Corporation is proud to feature its innovative products and technical presentations at SMTA International (SMTAI), from October 21-24, in Rosemont, Illinois. Indium Corporation will showcase the following among its featured products: Durafuse LT is an award-winning solder paste alloy system with versatile characteristics that...

Alliance Memory electronica 2024 Show Preview

Alliance Memory
12-15 November 2024Hall B5, Stand 300Trade Fair Centre Messe MünchenMunich, Germany Welcome to the Alliance Memory exhibit at electronica 2024. This year, we'll be showcasing our expanded portfolio, including DDR4 and LPDDR4X SDRAMs and high-density serial NOR Flash devices. To request an appointment to be briefed by David Bagby, Alliance Memory President and CEO,...

AC/DC flyback controllers from Nexperia enable higher power density GaN-based flyback converters

NEXP091: AC/DC flyback controllers
Nexperia introduced a new series of AC/DC flyback controllers as the latest additions to its continuously expanding portfolio of power ICs. The NEX806/8xx and NEX8180x are designed for GaN-based flyback converters in devices such as power delivery (PD) chargers, adapters, wall sockets, strip sockets, industrial power and auxiliary power supplies, and other AC/DC conversion applications requiring high...

Siemens launches intelligent link module to boost industrial automation data transparency

SIRIUS 3RC7 Intelligent Link Modules
Highlights: Complete data transparency down to the field level Field-level load feeders are seamlessly integrated into the automation system Detection of faults, deviations, and maintenance requirements facilitates diagnosis and enables preventive maintenance With the SIRIUS 3RC7 intelligent link module, Siemens now...

Rohde & Schwarz achieves full coverage of Skylo’s test plan for NB-NTN devices, enabling SMS services

CMW500
Rohde & Schwarz has successfully achieved full coverage of Skylo's comprehensive test plan for devices operating in Narrowband-IoT in Non-Terrestrial Networks (NB-NTN). This milestone also enables SMS services over NB-NTN, paving the way for unlimited connectivity on smartphones, wearables, and IoT devices. Rohde & Schwarz and Skylo Technologies have verified and validated all of...

Interview