As the World Races to Make More Chips, the Next Bottleneck May Be Femtosecond...
Femtosecond Laser - Last week, Apple announced that it would increase prices for its MacBooks and iPads by 20%, making it the...
GaN MMIC Design Simplified with Keysight and WIN’s New Tapeout Workflow
GaN MMIC Design - Keysight Technologies, Inc. (NYSE: KEYS) and WIN Semiconductors Corp. today announced a joint MMIC design workflow that enables GaN...
ams OSRAM OSLON UV-C 3535 LEDs, Now Available from Mouser, Serve the Demand for...
OSRAM OSLON UV-C 3535 LED - Mouser Electronics, Inc., the industry's leading New Product Introduction (NPI) distributor with the widest selection of...
SEMI Projects 300mm Memory Equipment Investment to Surpass $50 Billion in 2026
300mm Memory Equipment Investment - Worldwide 300mm fab equipment investment in the memory sector is projected to surpass $50 billion for the first time in 2026, rising...
Infineon named as the Company to Beat in AI Data Center Power Semiconductors by...
AI Data Center Power Semiconductors - In a recent report AI Vendor Race: Infineon Is the Company to Beat in AI Data Center...
BAE Systems Endura SoC Demonstrates Resilience in Harsh Space Radiation Environments
BAE Systems Endura SoC - BAE Systems has successfully demonstrated the ability of its Endura™ system-on-chip (Soc) space processor to operate resiliently in natural...
RS485 Digital Isolators: NOVOSENSE Launches SP301H/L Series with 8 Mbps Speed and High EMI...
RS485 Digital Isolators - NOVOSENSE Microelectronics today announced the launch of the SP301H/L series, a family of three-channel digital isolators built on its proprietary third-generation...
AI Infrastructure Materials: YINCAE to Showcase Advanced Packaging Solutions at IICIE 2026
AI Infrastructure Materials - YINCAE will showcase its latest innovations in advanced materials and packaging technologies at the International Integrated Circuit Innovation...
Product Spotlight: Up to 2x Better Performance and 2x Lower Jitter with Chorus 2...
Clock Generators - AI training clusters, smart factory vision systems and SmartNIC-based networking platforms share a common architectural shift: multiple heterogeneous chips...
GlobalFoundries SLATE Technology 9SW Platform Enables Advanced 3D Integration for RF Applications
GlobalFoundries SLATE Technology 9SW Platform - GlobalFoundries (Nasdaq: GFS) (GF) announced the production readiness of its SLATE™ wafer-to-wafer bonding technology on its industry-leading 9SW...
