MicroSys SoM platforms with NXP S32G Vehicle Network Processors now supports Hailo-8 AI Accelerator Modules
MicroSys Electronics new embedded SoM (System-on-Module) platform miriac AIP-S32G274A, which is based on NXP S32G vehicle network processors, now supports Hailo-8 AI accelerator modules. A...
Silicon Designs launched Low-G Series of MEMS DC Accelerometer Chips
Silicon Designs announced the global market launch of its Model 1525 Low-G Series of MEMS DC accelerometer chips, with stock quantities now...
Zener Diodes for precise Voltage reference with the industry’s lowest tolerance of ±1%
The comprehensive product range covers every application from 1.8 V to 75 V
Nexperia announced the industry's first range...
Vitesco & GaN Systems partner to co-develop GaN Power Semiconductor Technology
Vitesco Technologies has entered into a strategic partnership with Canada based GaN Systems Inc. as of November 18. GaN Systems is a...
80V Power MOSFET with Shield Gate Technology
Alpha and Omega Semiconductor Limited (AOS) announced the release of latest 80V Power MOSFET using patented Shield Gate Technology which is optimized for...
Renesas unveils Ultra-Low Power, Low-Cost ForgeFPGA Family to address Low-Density, High-Volume Applications
New ForgeFPGA Family Is Supported by Free, Easy-to-Use Software with No License Fees
Renesas Electronics Corporation is entering the...
DENSO Contributes to a Decarbonized Society by Providing SiC Power Semiconductors
DENSO Corporation has been contributing to spreading the use of electric vehicles, extending their mileage, and reducing CO2 emissions from vehicles by...
Renesas’ Automotive Chips Drive Next-Generation Multimedia System for Toyota Lexus
Renesas R-Car SoCs Contribute to Enhanced User Experience
Renesas Electronics Corporation R-Car H3 and R-Car M3 system-on-chips (SoCs) have...
Low clamping & Capacitance bidirectional Electrostatic Discharge (ESD) Protection Diodes
TrEOS diodes offer industry-leading insertion loss & return loss characteristics for more robust USB4 data transmission
Nexperia announced two PESD5V0R1BxSF...
Enhanced Re-flex II Carrier Tape Forming System for Semiconductor and Electronic Component Manufacturers
Adaptsys has introduced enhancements to the Re-flex II on-demand tape-forming system to deliver greater part-packaging speed and efficiency for semiconductor and other...
