ST Edge AI Suite goes live, accelerating AI-enabled product development with STMicroelectronics’ technologies
STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, announced the availability of ST Edge AI Suite, bringing together tools,...
Peregrine Semiconductor Introduces Arctic Sand’s New Product Family—the World’s Highest Efficiency, Lowest Profile LED...
TAMPA, Fla.—APEC 2017—March 2017—In Arctic Sand booth #432, Peregrine Semiconductor Corp., a Murata company, announces Arctic Sand’s new product family—the ARC3C family of LED...
Superconducting Chips to scale up Quantum Computers & boost Supercomputers
Superconducting processors could become a key ingredient for next generation of supercomputers. First, they could help tackling the major challenge of scaling...
STMicroelectronics to Acquire Majority Stake in Silicon Carbide Wafer Manufacturer Norstel AB
STMicroelectronics has signed an agreement to acquire a majority stake in Swedish silicon carbide (SiC) wafer manufacturer Norstel AB ("Norstel"). After closing, ST will...
ESSCI Teams Up with IITs to Revolutionize Semiconductor Industry
Electronics Sector Skills Council of India (ESSCI) proudly unveils a momentous leap forward in its relentless pursuit of skill development and innovation...
SemiQ to Showcase Third-Generation SiC and Wide Range of 1200 V SiC MOSFETs and...
SemiQ Inc, a designer, developer, and global supplier of superior silicon carbide (SiC) solutions for ultra-efficient, high-performance, and high-voltage applications, will showcase...
Magnachip released 600V Super Junction MOSFETs, Featuring Fast Recovery Body Diodes
Magnachip Semiconductor Corporation has released a new family of 600V Super Junction MOSFETs (Metal Oxide Semiconductor Field Effect Transistors) consisting of nine...
Vishay introduced the Industry’s first AEC-Q102 qualified Linear Optocoupler
Vishay Linear Optocoupler Offers Faster Response Times, Higher Isolation Voltage & Transfer Gain Stability
Vishay Intertechnology introduced the industry's...
Latest XSPairFET Buck-Boost MOSFET for Type-C Applications
Alpha and Omega Semiconductor Announces Latest XSPairFET Buck-Boost MOSFET for Type-C Applications at the 2019 Applied Power Electronics Conference (APEC) in Anaheim, CA
The new Buck-Boost MOSFET...
Die-to-Wafer Self-Assembly Breakthrough Targeting High Alignment Accuracy and Throughput
In a breakthrough for the future of die-to-wafer (D2W) bonding, CEA-Leti and Intel have optimized a hybrid direct-bonding, self-assembly process that has...
