RISC-V Tech Market Size Worth USD 17.40 Billion by 2034 | CAGR: 29.2%
Open-standard instruction set architectures (ISAs) are becoming common in the semiconductor industry. The shift is being led by RISC-V. The open-source nature...
TI DLP technology delivers high-precision digital lithography for advanced packaging
What's new: Texas Instruments is enhancing the next generation of digital lithography with the introduction of the DLP991UUV digital micromirror device (DMD), the company's...
Nexperia application-specific MOSFETs provide enhanced dynamic current sharing for high power industrial applications
Nexperia introduced the latest additions to its ever-expanding portfolio of application-specific MOSFETs (ASFETs), whose features have been tuned to meet the exacting...
Chip Design: India’s Deep Tech Trump Card That Needs More Than Just Talent
As the world races toward a trillion-dollar semiconductor future, the spotlight is often on chip fabrication the billion dollar fabs, geopolitical rivalries,...
ROHM has Developed New Smart Switches Optimized for Zonal Controllers
ROHM has developed six new high-side Smart Switches (Intelligent Power Devices, short: IPDs) BV1HBxxxEFJ series (BV1HB008EFJ-C, BV1HB012EFJ-C, BV1HB020EFJ-C, BV1HB040EFJ-C, BV1HB090EFJ-C, BV1HB180EFJ-C) with highly...
Synopsys Marks 30 Years of Operations in India with Inauguration of New Bengaluru Site
Synopsys, Inc., the global leader in engineering solutions from silicon to systems, celebrated 30 years of operations in India with the opening...
Littelfuse Launches IX3407B Isolated Gate Driver to Simplify High-Power Designs
Littelfuse, Inc. a diversified industrial technology manufacturing company empowering a sustainable, connected, and safer world, announced the release of the IX3407B, a single-channel,...
Snapdragon 8 Elite Gen 5, the World’s Fastest Mobile System-on-a-chip
Highlights:
The 3rd Gen Qualcomm Oryon CPU is the fastest mobile CPU ever.
With state-of-the-art...
ROHM and Infineon collaborate on silicon carbide power electronics packages to enhance flexibility for...
ROHM and Infineon Technologies AG have signed a Memorandum of Understanding to collaborate on packages for silicon carbide (SiC) power semiconductors used...
Velinktech’s A-PHY Automotive SerDes Chipset Enters Mass Production: Q&A With Velinktech CTO
MIPI A-PHY recently reached a significant milestone in its evolution: Becoming the first SerDes standard to enter mass production with a global automotive...
