CG Power and Industrial Solutions Limited, Renesas and Stars Microelectronics, to Jointly Build Outsourced...
                    
CG Power and Industrial Solutions Limited (“CG”), a part of Tube Investments of India Limited and the Murugappa Group; Renesas Electronics Corporation...                
            Nordson Test & Inspection to Unveil Next-Generation Inspection and Metrology Technology at SEMICON Taiwan
                    
Nordson Test & Inspection announced plans to unveil advanced technology at SEMICON Taiwan, scheduled to take place at TaiNex in Taipei at...                
            Vishay Gen 3 650 V and 1200 V SiC Schottky Diodes Increase Efficiency While...
                    
Vishay SiC Schottky Diodes:
Vishay Intertechnology, Inc. introduced three new Gen 3 650 V and 1200 V silicon...                
            Biden-Harris Administration Announces CHIPS Incentives Award with Amkor Technology to Bring End-to-End Chip Production...
                    
The Biden-Harris Administration announced that the U.S. Department of Commerce awarded Amkor Technology Arizona, Inc., a subsidiary of Amkor Technology, Inc., up...                
            ROHM’s New N-channel MOSFETs Offer High Mounting Reliability in Automotive Applications
                    
ROHM has released N-channel MOSFETs - RF9x120BKFRA / RQ3xxx0BxFRA / RD3x0xxBKHRB - featuring low ON-resistance ideal for a variety of automotive applications,...                
            Global Semiconductor Fabrication Material Market Worth USD 30.49 Billion by 2020 – Analysis
                    The global Semiconductor Fabrication Materials market was USD 24.2 Billion in 2014 and is estimated to reach USD 30.49 Billion, at a CAGR of...                
            New generation In-Vehicle Network protection diodes by Nexperia
                    Nexperia, the former Standard Products division of NXP, today announced a new generation of in-vehicle network (IVN) protection diodes that offer a higher surge...                
            ROHM has Developed New Smart Switches Optimized for Zonal Controllers
                    
ROHM has developed six new high-side Smart Switches (Intelligent Power Devices, short: IPDs) BV1HBxxxEFJ series (BV1HB008EFJ-C, BV1HB012EFJ-C, BV1HB020EFJ-C, BV1HB040EFJ-C, BV1HB090EFJ-C, BV1HB180EFJ-C)  with highly...                
            Infineon unveils the world’s thinnest silicon power wafer, pushing technical boundaries and improving energy...
                    
Highlights:
Infineon first to master handling and processing of ultra-thin 20-micrometer power semiconductor wafers
                
            Intel tops Semiconductor Supplier List in 2020
                    
IC Insights’ November Update to the 2020 McClean Report, released later this month, includes a discussion of the forecasted top-25 semiconductor suppliers in 2020. This...                
             
            
 
		

















