StudentZone—ADALM2000 Activity: An Ohm’s Law Experiment
Objective
This lab activity demonstrates and defines how electrical charge relates to voltage, current, and resistance. It introduces Ohm’s...
R&D Advances for the FAMES Pilot Line: 400 °C CMOS Breakthrough Opens Critical Doors...
CEA-Leti, the coordinator of the FAMES Pilot line, has achieved a major milestone for next-generation chip stacking: fully functional 2.5 V SOI CMOS...
Quantum Computing for Beginners: A Complete Easy Guide
Okay, so… quantum computing. Sounds pretty scary, right? I used to think the same thing earlier but when I tried to understand...
Tata and Intel Announce Strategic Alliance to Establish Silicon and Compute Ecosystem in India
Tata Group, a global enterprise headquartered in India and Intel Corporation announced a strategic alliance to explore a collaboration focused on consumer...
Siemens and nVent to release joint reference architecture purpose-built for NVIDIA AI data centers
Highlights:
Modular, Tier III-capable blueprint helps operators deploy AI infrastructure faster, smarter, and more sustainably
Spacechips drives imaginative new AI-enabled satellite applications
Vicor Corporation, the demand for smaller satellites with sophisticated computational capabilities and reliable and robust onboard processor systems to support the five...
5G Infrastructure Market Size Worth USD 161.61 Billion by 2034 | CAGR: 29.5%
The global 5G Infrastructure Market is entering a phase of dramatic expansion, with the total market size expected to surge from USD 12.25 billion in 2024 to...
Marvell Announces Adoption of Its PCIe Retimers by Leading AI and Data Center Infrastructure...
Alaska P PCIe 6 Retimers:
Marvell Technology, Inc. , a leader in data infrastructure semiconductor solutions, announced industry adoption...
Indium Corporation Expert to Present on Advancements in Bi-free In-containing Lower-Temperature Solder at ICEE...
Indium Corporation’s Senior R&D Manager of the Alloy Group, Hongwen Zhang, Ph.D., will present on the company’s award-winning Durafuse Technology during the IEEE International Conference on...
CEA-Leti & STMicroelectronics’ Paper at IEDM 2025 Demonstrates Path to Fully Monolithic Silicon RF...
CEA-Leti and STMicroelectronics presented results at IEDM 2025 showcasing key enablers for a new high-performance and versatile RF Si platform cointegrating best-in-class active...
