Industry’s First ASi-5 ASSP for Industrial Automation
Renesas Electronics introduced the ASI4U-V5 ASSP – the industry’s first silicon solution to fully implement the ASi-5 (Actuator Sensor Interface version specification version...
World’s first dedicated chipset for ‘wearables’ to be launched
Huawei Consumer Business Group, India, announced the world's first and only chipset exclusively for wearables will be coming to India early next...
STMicroelectronics Unleashes Enhanced NFC Experiences of New iOS 13 Platform
STMicroelectronics is enhancing software support for smartphone app developers to unleash the full potential from the new Core NFC framework of the...
Multiband Wireless Communication LSI Optimized for Smart Meters World-wide
ROHM Group company LAPIS Semiconductor recently announced the availability of a multiband (sub-1GHz/2.4GHz) wireless communication LSI, ML7421, optimized for applications requiring low...
Pasternack Announces Comprehensive 5G Solution Portfolio
Pasternack announces a comprehensive portfolio of 5G RF solutions serving the urgent needs of engineers and technicians around the world with high-grade...
Japan’s First System for Automatically Generating Electronic Submission Data
Fujitsu Limited has developed tsClinical for SDTM Automation, a solution for pharmaceutical companies that automatically converts electronic study data to the standardized...
World’s first “High Durability Learning” technology for High-Accuracy AI Operations
Fujitsu Laboratories announced the development of the world's first "High Durability Learning" technology that estimates the accuracy of AI and automatically restores...
MRI System Emerging Techniques to Scale Higher Growth Rate
The advent
of Superconducting Magnets and Software Upgrades to Boost Market
Using magnetic resonance imaging technique
is considered as an effective...
Bizen: A Transistor Wafer Process Technology
A UK collaboration between Nottingham-based start-up, Search For The Next (SFN) and Glenrothes-based Semefab introduced Bizen, a transistor wafer process technology...
Next Generation STPay System-On-Chip Payment Solution
STMicroelectronics has released the next generation of its STPay system-on-chip (SoC) payment solution, leveraging state-of-the-art technology to increase contactless performance and protection,...
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