EDI CON China 2018 Dates, Venue and Location

477

Electronics Design Innovation Conference (EDI CON) is an international conference on electronics design and innovation. EDI CON China is china’s premier conference which brings together RF, microwave, EMC/EMI, and high-speed digital design engineers and system integrators for networking, training, and learning opportunities.

Attendees get an opportunity to find solutions, products and design ideas that they can put into practice to develop today’s electronics components. Conference is going to take place on March 20 -22, 2018 at Beijing China.

A Brief of EDI CON China 2018

Date March 20 – 22, 2018
Country China
City Beijing
Venue China National Convention Center, Beijing, China.
Frequency annual
Organizer Microwave Journal
Web www.ediconchina.com
Contacts rmumford@mwjournal.com
SHARE
Previous articleStefanini Invests in Technological Solutions Focused on Industry 4.0
Next articleCyber Economics
Electronics Media is an Indian electronics and tech journalism platform dedicated for international electronics and tech industry. EM covers news from semiconductor, aerospace, defense-e, IOT, design, tech startup, emerging technology, innovation and business trends worldwide. Follow us on twitter for latest update in industry.

LEAVE A REPLY