Electronics Design Innovation Conference (EDI CON) is an international conference on electronics design and innovation. EDI CON China is china’s premier conference which brings together RF, microwave, EMC/EMI, and high-speed digital design engineers and system integrators for networking, training, and learning opportunities.
Attendees get an opportunity to find solutions, products and design ideas that they can put into practice to develop today’s electronics components. Conference is going to take place on March 20 -22, 2018 at Beijing China.
A Brief of EDI CON China 2018
|Date||March 20 – 22, 2018|
|Venue||China National Convention Center, Beijing, China.|