New TO-Leadless Packaging in combination with 40V Shield-Gate Technology for High Power Applications

 Alpha and Omega Semiconductor Limited (AOS) , a designer, developer and global supplier of a broad range of power semiconductors and power ICs, introduced the TO-Leadless (TOLL) package in combination with 40V Shield-Gate Technology (SGT) to provide the highest current capability in its voltage class.  The TOLL package has the highest current capacity because of AOS’ innovative technology which utilizes a clip to achieve the 400A DC at 25°C capability.  The TOLL packaging technology offers very low package resistance and inductance due to the clip technology in comparison to other TO-Leadless packages using standard wire-bonding technology which enables improved EMI performance.

The AOTL66401 (40V)  has a 30% smaller footprint compared to a TO-263 (D2PAK) package, including having higher current carry capability that enables the designer to reduce the number of devices in parallel. This new device offers a higher power density in comparison to existing solutions, and is ideally suited for industrial BLDC motor applications and battery management to reduce the number of MOSFETs. The AOTL66401 has a 0.7mOhm max rating at 10Vgs with a maximum drain current of 400A at 25°C and 350A at 100°C case temperature.  The pulsed current is rated at 1600A, which is limited by the maximum junction temperature of 175°C.

“With the significant performance improvement, the TOLL with clip technology is a robust package which enables low package parasitics reducing EMI.  The AOTL66401 simplifies new designs with the higher current density to enable savings in overall system cost due to a reduced number of devices in parallel. AOS’ TOLL package is best suited for high power applications,” said Peter H. Wilson.

Technical Highlights

Pricing and Availability

The AOTL66401 is immediately available in production quantities with a lead-time of 12-14 weeks. The unit price for 1,000 pieces is $3.9.