Indium Corporation will feature its InFORMS ESM02, a reinforced solder fabrication designed to produce consistent bondline thickness for die-level attach applications, at PCIM 2019, May 5-7, Nuremberg, Germany.
Indium Corporation’s InFORMS ESM02 is a reinforced matrixed solder composite that produces a high-reliability solder joint with increased thermal and mechanical performance for the development of new, or the improvement of existing, applications.
Previous InFORMS technology was only applied at the baseplate level; however, new production capabilities have expanded its use to the die-level with a bondline of 50μm. Other benefits of InFORMS include:
- Drop-in replacement for other bondline control methods
- Increased lateral strength
- Bondline co-planarity
- Improved thermal cycling reliability
- Availability in ribbon and preforms
For more information about Indium Corporation, visit www.indium.com
