iWave launches iW-RainboW-G50M: The Solderable NXP i.MX 93-based LGA System on Module (SoM). The SoM incorporates NXP’s powerful i.MX 93 applications processor and is built on the OSM v1.1 solderable SoM standard, providing extensive interfaces in a rugged and compact form factor. Evaluation Kits of the System on Module will be ready to purchase in March 2023.
NXP’s i.MX 93 SoC is the first in the industry to integrate the Arm® Ethos-U65 microNPU and the first in the i.MX Family to integrate the scalable Arm® Cortex®-A55 core features the latest Armv8-A architecture extensions with dedicated instructions to accelerate machine learning (ML).
Key features of iW-RainboW-G50M
- NXP i.MX 9352 SoC
- 2 × Cortex-A55 + 1 × Cortex-M33
- NPU up to 0.5 TOPS
- 2GB LPDDR4X RAM & 8GB eMMC Flash
- 2-Lane MIPI-CSI and 4-Lane MIPI-DSI Interface
- 2 x RGMII, 2 x CAN-FD, 1 x LVDS
- 1 x USB 2.0 OTG, 4 x USB 4.0 Host
- Wi-Fi 6 & Bluetooth 5.2 Connectivity
- Size-L Form Factor: 45mm x 45mm
- Solderable LGA Package in OSM v1.1 Standard
- 662 Contacts
The System on Module is built on a 45mm x 45mm OSM Size-L standard with the provision for 662 contacts, offering the highest pin-to-area ratio across SoM standards. With the ability to directly solder the SoM onto the carrier card, the SoM ensures high levels of robustness and is ideal for products prone to vibrations.
The SoM supports the MIPI-CSI camera interface to leverage the integrated NPU while supporting a 4-lane MIPI-DSI with 1080p60 resolution for 2D graphics processing through a high-efficiency pixel pipeline. The availability of high-speed interfaces such as USB 2.0, Gbit ethernet, and CAN-FD makes the SoM ideal for industrial and automotive market segments.
Building on the ML capabilities of NXP’s i.MX 93 applications processor, the SoM can be adopted by product companies as a powerful building block for machine vision, AIoT, Smart City, Industrial automation, and other ML-related applications.
“With billions of devices connected worldwide and the rise of AI on the edge, it is crucial to ensure safety, energy efficiency, and compute power,” said Immanuel Rathinam, Vice President – System on Modules at iWave.” NXP’s i.MX 93 OSM System on Module enables a new generation of intelligent devices across industrial, IoT, and automotive applications and speeds up time to market with reduced risk and complexity.”
“The i.MX 93 applications processors deliver a strong combination of performance and power optimization to accelerate processing and machine learning at the edge,” said Justin Mortimer Senior Director Secure Connected Edge at NXP Semiconductors. “ïWave’s iW-Rainbow-G50 SOM, by utilizing the new OSM standard, ensures our latest processing technology is both accessible and applicable to a wider range of embedded applications.“
The i.MX 93-based System on Module is also integrated on a carrier board, which is positioned as a Single Board Computer and also doubles up as an evaluation kit. The production-ready Single Board Computer is built on a Pico-ITX form factor and integrates across various AI and ML applications. Software companies can concentrate on their core competencies, such as AI and machine learning algorithms and software, and enable them on the Single Board Computer.
Key Features of the Single Board Computer
- NXP i.MX 9352 SoC
- 2GB LPDDR4X RAM, 16GB eMMC
- Dual Gigabit Ethernet
- Dual USB 2.0 Host & USB 2.0 OTG
- Micro SD Slot and M.2 Connector Key B
- MIPI CSI Camera Connector
- MIPI DSI Display Connector
- LVDS Display Connector
- RS232 and CAN header
- 3.5 mm Audio In/Out through I2S Codec
- Wi-Fi 6 and Bluetooth 5.2 Module
- GNSS Receiver module
- Line In / Out Speaker Header
The System on Module and Single Board Computer are go-to-market and production ready, with all documentation, necessary software drivers, and BSP available for customers. iWave maintains a product longevity program and ensures the availability of the modules for 10+ years.