The electronics industry is dynamically changing with rapid advancements and requires faster data transmission, real-time processing, increased computing, etc. The integrated circuit industry is not untouched by this, for stable and reliable connections between high-speed, high-density chips have become a critical challenge. Additionally, rising power consumption by these chips results in greater heat generation, thus requiring thermal management.

The Emergence of Interposer PCBs

To address these challenges, interposer PCBs have emerged as a groundbreaking solution. Interposer PCBs connect and integrate different electronic components with high precision and high-layer arbitrary interconnection HDI PCB. These are placed between two components and act as a bridge that allows signals and power to pass between chips more efficiently. Acting as an intermediary layer, they establish electrical connections between micro bumps (uBump) on the chip and intricate routing layers through advanced pad leads and interconnect technologies. The intermediary layer employs through-silicon vias (TSV) to seamlessly connect different layers, enabling optimal electrical performance.

The design of interposer PCBs involves intricate laser microvias and dense routing, creating a sophisticated multi-structure that includes BGA connections on the top side and pad connections on the bottom. These design elements contribute to their exceptional performance in high-end electronic applications.

PCBWay’s Breakthrough Innovation

As a leading manufacturer of high-end HDI PCBs, PCBWay remains at the forefront of market advancements. In response to increasing client demands for high-order arbitrary interconnection (Anylayer) HDI boards, PCBWay’s product research institute dedicated extensive efforts to overcoming technical barriers. This commitment has resulted in the successful development of 24-layer, 6-order arbitrary interconnection interposer PCBs, reinforcing PCBWay’s position as an industry pioneer. Let us see some benefits and application areas of Interposer PCBs followed by high-precision circuit products using the 24-layer, 6-order Anylayer HDI PCB example by PCBWay.

Advantages of Interposer PCBs

Interposer PCBs offer several key advantages that significantly enhance the performance of integrated circuits:

1. Enhanced Connection Speed and Reliability: Utilizing high-performance materials, interposer PCBs facilitate short-distance, high-density connections between chips. This dramatically improves data transmission rates and overall circuit reliability.
   
2. Signal Integrity and Power Efficiency:  With its routing layer minimize the signal loss by reducing the transmission paths, minimizing parasitic capacitance and inductance as it directly connects signal pins to the interposer layer.
   
3. Thermal Management: The interposer layer plays a crucial role in dissipating heat, effectively lowering components’ temperatures to protect them from being damaged.
   
4. Heterogeneous Integration: Interposer technology enables seamless connections between integrated circuits with different functionalities, thus supports complex design.

Wide-Ranging Applications

Interposer PCBs are widely used in industries that demand high-performance computing and high-speed data processing, including:

• High-Performance Computing: Facilitating large-scale computing by connecting multiple processing chips.
  
• Artificial Intelligence: Enhancing neural network training and inference speeds through efficient chip interconnections.
  
• Data Centers and Communications: Providing higher transmission rates and bandwidth to meet the needs of big data processing and high-speed communication networks.

Here, we will showcase the details of this high-precision circuit product using the 24-layer, 6-order Anylayer HDI PCB as an example.

1. Product Parameters

2. Product Structure

3. Technical Challenges

Challenge 1: The buried via PCB thickness from L7 to L18 is 1.0 mm, with a mechanical through-hole diameter of 0.1 mm, resulting in a hole aspect ratio of 10:1, making mechanical drilling difficult.

Challenge 2: The BGA pitch is 0.35 mm, and the distance from the hole to the conductor trace is 0.13 mm, which makes it easy for misalignment during multiple laminations.

Challenge 3: The trace width/spacing is 2.4/3 mil, and it features dense routing. Below are some routing diagrams.

4. Finished Product Pictures

With this innovation, PCBWay continues to push the boundaries of PCB technology, delivering cutting-edge solutions for the evolving needs of modern electronics.