Power Module Packaging – Indium Corporation® Senior Area Technical Manager Leo Hu will examine the keys to precisely matching the diverse process requirements of power module packaging and assembly at CIPA 2026, August 31-September 2, in Wuxi, China.
The presentation, titled Co-innovation of Materials and Processes for Advanced Semiconductor Packaging, explores how advanced soldering and sintering materials are enabling the next generation of power electronics built with wide bandgap semiconductors. The session will demonstrate how innovative, properly selected materials solutions can improve reliability, extend device life, and deliver stable performance under extreme operating conditions while supporting the growing demands of electrification and high-power applications.
Leo Hu is a senior area technical manager for East China and is based at Indium Corporation’s Suzhou facility. In this role, he manages the regional technical support team and partners with the company’s global organization to provide product and application solutions to customers. Hu has 20 years of experience in semiconductor packaging, specializing in advanced assembly technology development, process improvement, and assembly materials applications. He has presented multiple technical articles at global forums and academic conferences and serves as a member and reviewer for the China SMTA Technical Advisory Committee. Hu holds a master’s degree in integrated circuit engineering from the Institute of Computing Technology, Chinese Academy of Sciences, and a bachelor’s in science from Nankai University.
CIPA 2026 visitors can attend Hu’s presentation on August 31, 11:40–12:00 China Standard Time (UTC+8). To learn more about Indium Corporation’s power electronics packaging portfolio, visit indium.com.
