System-in-Package (SiP) Technology – Octavo Systems’ System-in-Package devices bring a processor, memory and supporting components together in one package. At electronica 2026, Astute Group will show how that integration can support compact designs, with a special demonstration being prepared by German robotics company Olive Robotics.
For a robot sensor, industrial controller or medical instrument, the processor is only part of the hardware challenge. Memory connections and supporting circuitry also take board space and engineering effort. Integrating those core connections can leave more room to develop the interfaces and functions that make the finished product useful.
The OSD62x-PM illustrates the approach: a Texas Instruments AM62x processor, DDR4 memory and essential passive components in a 9 × 14 mm package. Power management remains external, giving engineers scope to use their own system power design. Other Octavo families integrate more circuitry, including power management, across processor platforms from Texas Instruments, STMicroelectronics and AMD.
Robotics offers a particularly interesting application. A sensor module can process measurements close to where they are collected, then pass useful information to the wider robot. Olive Robotics has used Octavo’s OSD32MP15 technology in ROS-native sensor modules, combining embedded processing with sensor integration.
Come and see the special demonstration, then bring your software, memory and interface requirements to Astute’s experts. Explore where a SiP could remove work from your board design and make room for the application itself.
Octavo’s SiPs sit within the wider range of technology Astute will feature at Messe München on 10–13 November. Visit Hall C5, Stand 421, to explore how we can help with component selection and your next design.
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