Thermal Interface Materials – Indium Corporation® Research and Development Manager Jie Geng will discuss how the development of thermal interface materials (TIMs) is increasingly driven by the ability to deliver reliable thermal performance throughout a product’s lifetime at the 2026 IEEE Reliability for Electronics and Photonics Packaging (REPP) Symposium, November 12-13, in Los Angeles, California.
The presentation, The Evolution of Thermal Interface Materials: Reliability Challenges and Emerging Directions for AI and HPC Packaging, explores TIMs technologies, from polymer-based greases and phase-change materials to metallic, carbon-based, and hybrid solutions. It examines reliability challenges, including pump-out, dry-out, creep, oxidation, interfacial degradation, thermomechanical fatigue, and long-term changes in thermal resistance. Geng will also discuss the relationship between material properties, package architecture, manufacturing constraints, and failure mechanisms from a physics-of-failure perspective. The discussion also addresses reliability qualification strategies and testing methodologies needed to evaluate next-generation TIMs under increasingly demanding AI and HPC operating conditions.
Jie Geng is the R&D Manager of Thermal Interface Materials at Indium Corporation, leading the development of advanced TIMs technologies and innovative thermal testing methodologies for high-performance electronics. Since joining the company in 2016, he has played a key role in advancing commercially successful products, including Indalloy®276, Indalloy®292, and Durafuse® HR. With more than 40 peer-reviewed publications, he brings extensive expertise in materials innovation, processing, and characterization. Geng holds a Ph.D. from the University of Surrey and is a Certified SMT Process Engineer. He serves on the IEEE EPS Materials & Processes and Thermal Mechanical Technical Committees.
IEEE REPP Symposium attendees can attend Geng’s presentation on November 13, 11:30 a.m. PST. To learn more about Indium Corporation’s TIMs solutions, visit indium.com.
