Next-Generation VITA 91 MIL HD2 Connector Now Available from Amphenol Socapex
Amphenol Socapex announces the launch of the VITA 91: MIL HD2, a cutting-edge COTS interconnect system designed for military and aerospace embedded...
Renesas Delivers New Motor Control MCUs with Industry-Leading Performance and High-Speed Networking Interfaces
RA8T2 MCUs:
Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, introduced the RA8T2 microcontroller (MCU) group...
Texas Instruments’ TPS1685 Stackable Integrated Hotswap eFuses, Now at Mouser, Provide Maximum Protection for...
Mouser Electronics, Inc., the industry's leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components, is now...
YINCAE Launches Diamond Underfill UF 158D with 8 W/m·K Thermal Conductivity
YINCAE, a leader in advanced electronic materials, has introduced Diamond Underfill UF 158D, delivering 8 W/m·K thermal conductivity—a new standard in heat...
Vishay Intertechnology Releases New 1 A and 2 A Gen 7 1200 V FRED...
Vishay Intertechnology, Inc. expanded its Gen 7 platform of 1200 V FRED Pt® Hyperfast rectifiers with four new devices in the eSMP®...
Littelfuse Launches Industry-First AEC-Q200-Compliant High-Voltage Fuses Rated Up to 1,000 VDC
Littelfuse, Inc., a diversified, industrial technology manufacturing company empowering a sustainable, connected, and safer world, announced the release of the 828 and 827...
New at Mouser: Samtec Nitrowave RF Cable Assemblies for Aerospace, Computing, and Instrumentation Applications
Mouser Electronics, Inc., the authorized global distributor with the newest electronic components and industrial automation products, is now shipping the new Nitrowave RF cable...
Sfera Labs Introduces SuperCaps UPS Expansion Board for Strato Pi Max
Sfera Labs has released the new SuperCaps UPS X2-Series Expansion Board, bringing integrated, supercapacitor-based backup power to its Strato Pi Max XL and XS...
Infineon expands XENSIV MEMS microphone lineup delivering best-in-class audio and power performance
Infineon Technologies AG has expanded its XENSIV MEMS microphone lineup with the introduction of the IM72D128V and IM69D129F, two innovative digital PDM...
ROHM Launches 2-in-1 SiC Molded Module “DOT-247”
ROHM has developed the "DOT-247," a 2-in-1 SiC molded module (SCZ40xxDTx, SCZ40xxKTx), ideal for industrial applications such as PV inverters, UPS systems,...
